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Micron Technology

Makes memory and storage chips for AI and PCs

Manufacturing Alignment Engineer - Thin Films/Diffusion

Process EngineeringPosted on Nov 10
Full-timeManassas, VA, USA

About the Job

Requirements

  • A bachelor's degree in Engineering, Physics, Materials Science, Chemistry, or a related technical discipline, or equivalent industry experience.
  • At least five years of semiconductor manufacturing experience as a Process Owner, Equipment Owner, Process Engineer, Equipment Engineer, or in a related engineering role.
  • Experience supporting CVD, CMP, Thin Films, Diffusion, or related semiconductor process technologies.
  • Strong understanding of semiconductor manufacturing systems, process control methodologies, equipment operations, and continuous improvement practices.
  • Experience leading or coordinating multifunctional teams, site-level initiatives, or global engineering programs.
  • Ability to travel domestically and internationally as business needs require.

Responsibilities

  • Lead the development and execution of global manufacturing alignment programs that standardize Best Known Methods, improve operational consistency, and drive performance improvements across the fabrication network.
  • Drive initiatives focused on equipment utilization optimization, idle tool management, POR-to-MOR gap closure, manufacturing efficiency, and productivity improvements.
  • Coordinate and influence global efforts involving ESTA programs, recipe alignment, process matching, defect reduction, and technology performance optimization.
  • Partner with multifunctional manufacturing and engineering teams to standardize preventive maintenance practices, qualification methodologies, scrap reduction initiatives, and recurrence prevention strategies.
  • Facilitate alignment across sites by developing common standards, tracking execution progress, and communicating key performance indicators and business outcomes to senior leadership.
  • Identify opportunities to simplify processes through automation, advanced analytics, and AI-enabled solutions that improve manufacturing effectiveness and engineering productivity.
  • Drive continuous improvement initiatives that strengthen manufacturing readiness, technology transfer success, and long-term operational sustainability.

Desired Qualifications

  • Deep technical expertise in Thin Films, CVD, CMP, or Diffusion process and equipment engineering.
  • Demonstrated success driving manufacturing improvements in semiconductor wafer fabrication environments.
  • Experience deploying and sustaining Best Known Methods across multiple manufacturing sites.
  • Proven track record of leading global alignment initiatives that improve quality, equipment performance, cycle time, yield, or cost.
  • Experience using artificial intelligence, automation, advanced analytics, or digital manufacturing solutions to improve operational effectiveness.
  • Knowledge of Agentic AI applications, workflow automation frameworks, and AI-driven decision-support tools within engineering or manufacturing environments.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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