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Corning

Specialty glass, ceramics, and tech components

Senior Scientist - MEMS & Optoelectronic Device Process Integration

Hardware EngineeringUpdated on Nov 14
Full-timeCorning, NY, USA

About the Job

Requirements

  • A Ph.D. in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related discipline, or a Master’s degree in a related field with 2–3 years of relevant industrial research and development experience.
  • Hands-on experience in semiconductor processing and cleanroom fabrication, particularly in microelectromechanical systems-related development.
  • Demonstrated expertise in one or more of the following: microelectromechanical systems design and fabrication; optical or photonics component design; thin-film materials and microfabrication processes.

Responsibilities

  • Lead the design, development, and integration of semiconductor devices, advanced microelectromechanical systems, and optical components for optoelectronic, photonic, and connectivity applications.
  • Translate device concepts into rapid proof-of-concept prototypes, execute testing, and demonstrate core functionality through internal and external process capabilities.
  • Translate proof-of-concept test results into system-level requirements and mature manufacturable products and processes for transfer to new or existing business development teams.
  • Drive end-to-end development in partnership with business development teams from concept through fabrication, integration, and pilot-line validation, collaborating across internal teams and external partners.
  • Design microelectromechanical systems devices and optical components, including waveguides, couplers, micro-optics, and sensors.
  • Partner with mechanical and optical modeling teams to define device architecture and optimize performance.
  • Use layout design tools such as Mentor Graphics, L-Edit, KLayout, or SolidWorks to create mask layouts for device fabrication.
  • Apply knowledge of semiconductor device physics and metal-oxide-semiconductor transistor test methodologies.
  • Develop and integrate semiconductor and microelectromechanical systems processes, including thin- and thick-film organic or inorganic deposition, photolithography, wet and dry etching, metallization, and bonding for silicon, glass, and fused silica wafers and substrates.
  • Lead end-to-end process integration for rapid proof-of-concept development through internal and external process capabilities.
  • Own and optimize critical process modules, including process window definition and control strategy development.
  • Partner with modeling teams to define and evaluate key optical performance metrics, including insertion loss and coupling efficiency.
  • Lead optical testing efforts and drive data-based optimization of device designs.
  • Coordinate with external vendors and foundries to support fabrication, assembly, and testing.
  • Translate designs into specifications and manage iterative design, fabrication, and test learning cycles.
  • Provide technical leadership across cross-functional research and development and business teams through subject-matter expertise and clear communication.
  • Mentor junior team members and contribute to technical strategy, prioritization, and roadmap execution.
  • Travel occasionally (<10–15%) for vendor engagement, partner coordination, and technical reviews.

Desired Qualifications

  • Experience in co-packaged optics, photonic integration, or advanced packaging.
  • Familiarity with non-silicon platforms, including glass-based or heterogeneous integration approaches.
  • Experience working with external fabrication partners and managing multi-site development cycles.
  • Experience transitioning technologies from research and development into pilot-scale or manufacturing environments.

About the Company

Corning

Specialty glass, ceramics, and tech components

Corning develops and manufactures specialty glass, ceramics, and related components for a range of industries. Its engineered glass and ceramic materials are produced and integrated into devices and systems such as smartphone screens, high‑performance displays, optical networks, automotive emissions controls, and life‑science equipment. The company differentiates itself with a broad portfolio across multiple markets, material science expertise, reliable supply, and end‑to‑end components and systems. Its goal is to help customers achieve performance and reliability by providing durable, high‑quality materials and connected solutions that scale with growing demand.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Corning, NY
Founded
1851

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