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Micron Technology

Makes memory and storage chips for AI and PCs

Process Development Engineer Intern - 3D DRAM CMP

Process EngineeringConfirmed live in the last 24 hours
Internship · Fall 2026Boise, ID, USANo salary listedIn-person

About the Job

Requirements

  • Currently pursuing a Ph.D. or equivalent degree in Materials Science, Chemical Engineering, Chemistry, Physics, or a related technical field.
  • Must be enrolled as a student and continue academic studies beyond September 2027.
  • Demonstrated experience with experimental design, data analysis, and interpretation of technical results.
  • Strong analytical, problem-solving, and quantitative reasoning skills.
  • Ability to manage project work independently and communicate technical findings effectively through presentations and written reports.

Responsibilities

  • Develop and evaluate Chemical Mechanical Planarization processes that meet product requirements for physical and electrical performance in advanced Dynamic Random-Access Memory technologies.
  • Partner with multifunctional process and equipment engineering teams to identify, implement, and validate process improvements.
  • Apply root-cause analysis and failure-mode methodologies to identify process limitations and drive corrective actions.
  • Conduct fundamental research and experimental studies to support next-generation semiconductor process development.
  • Analyze statistical process and manufacturing data and apply Artificial Intelligence, AI-assisted tools, or AI-enabled methodologies to improve process understanding, data analysis, and project efficiency.

Desired Qualifications

  • Experience with semiconductor processing, materials characterization, process development, or manufacturing research.
  • Knowledge of advanced statistics, statistical process control, process optimization, or design of experiments.
  • Experience applying root-cause analysis, failure analysis, or model-based problem-solving methodologies.
  • Programming or scripting experience using Python, MATLAB, JMP, R, or similar analytical platforms.
  • Experience applying, using, or leveraging Artificial Intelligence to improve research workflows, process analysis, data interpretation, automation, or engineering productivity.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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