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ASM International

Semiconductor deposition equipment and ALD tech

Senior Engineer 1 - Process Engineering

Process EngineeringConfirmed live in the last 24 hours
Full-timeTama, Tokyo, JapanNo salary listedIn-person

About the Job

Requirements

  • A Master's degree and at least 10 years of relevant industry experience, with some leadership experience such as serving as a team leader, or a preferred PhD in Materials Science and Engineering, Chemical Engineering, Chemistry, or Physics.
  • At least 3 years of experience as a Process Engineer in the semiconductor equipment industry; experience in ALD, PEALD, PECVD, Etch, and/or Process Integration is preferred.
  • Demonstrate expertise in the candidate's discipline and a basic understanding of related disciplines.
  • Know best practices, understand how the candidate's area integrates with others, and recommend product and process improvements.
  • Be willing to tackle new problems and develop strategies for project execution.
  • Have strong problem-solving skills, approach existing solutions from a fresh perspective, and think innovatively.

Responsibilities

  • Design experiments, collect data, analyze results, and compile reports on process development experiments.
  • Perform hardware characterization, define the process window, and analyze process-hardware interactions.
  • Troubleshoot complex problems, perform root cause analysis, and resolve difficult process engineering issues.
  • Generate internal and external documentation, including product documentation, presentations, and technical reports.
  • Interact with customers to resolve challenging process engineering issues with limited supervision.
  • Promote team building and provide technical and theoretical communication leadership.

Desired Qualifications

  • Knowledge of plasma physics, material chemistry, and vacuum chamber handling is preferred.
  • Experience troubleshooting or a good understanding of Process Integration challenges is highly desirable.
  • Experience measuring and improving device fabrication yield in pilot lines or high-volume manufacturing is highly desirable.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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