ASM International

Semiconductor deposition equipment and ALD tech

Field Process Engineer

Process EngineeringConfirmed live in the last 24 hours

Full-timeTainan City, TaiwanNo salary listed

About the Job

Requirements

A Master of Science in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field is required.
Zero to six years of experience in semiconductor process engineering, thin-film deposition, or a related field is required.
Hands-on experience with at least one thin-film deposition technology through research, internships, academic projects, or industry experience is required.
Working knowledge of statistics and Design of Experiments, with the ability to analyze data and present findings, is required.
Familiarity with structured troubleshooting methodologies is required.
The ability to prepare technical reports and present results to internal and customer teams is required.
Willingness to travel 25–50% domestically and internationally to support customer activities is required.
Professional working proficiency in English and Chinese is required.

Responsibilities

Develop and optimize unit processes, including ALD, PEALD, epitaxy, furnace, or PECVD, on assigned applications.
Own day-to-day customer requests on a single product or film by scoping issues, running experiments, and presenting results.
Design and execute Design of Experiments to validate new technology performance and accelerate readiness for high-volume manufacturing.
Validate tool performance and provide structured findings to Product Management to improve the product.
Implement Best Known Methods and document qualification results to help the team improve its cycle time.
Bring innovative ideas to recipe tuning and stay current with the state of the art.
Identify safety risks on the tool and help train newer engineers on safe execution.

Desired Qualifications

Experience with thin-film deposition, plasma processing, ALD, CVD, PVD, or semiconductor manufacturing.
Hands-on experience with vacuum systems, gas delivery systems, or metrology tools such as SEM, XRR, or ellipsometry.
Knowledge of new product introduction, process qualification, or high-volume manufacturing environments.
Experience applying structured problem-solving methodologies such as 5-Why, Fishbone, or FMEA.

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Job's Mission

ASM is recruiting for Field Process Engineer in our ALD/EPI/PEALD/CVD/CMP business function Taiwan. As part of a team, You'll be the engineer customers call when something on the recipe isn't behaving, and the one who finds the answer.

Location: Hsinchu, Taichung, Tainan, or Kaohsiung (you will be able to indicate your preferred work location when submitting your application.)

What you will be working on

• Developing and optimizing unit processes (ALD, PEALD, Epitaxy, furnace, or PECVD) on assigned applications
• Owning day-to-day customer requests on a single product/film: scoping the issue, running the experiment, presenting the result
• Designing and executing Design of Experiments (DOEs) to validate new technology performance and accelerate readiness for high-volume manufacturing (HVM)
• Validating tool performance and feeding structured findings back to Product Management to improve the product
• Implementing Best Known Methods (BKMs) and documenting qualification results so the team gets faster every cycle
• Bringing innovative ideas to recipe tuning and staying current with the state of the art
• Identifying safety risks on the tool and helping train newer engineers on safe execution

What we are looking for

MS in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field
0-6 years of experience in semiconductor process engineering, thin-film deposition, or a related field
Hands-on experience with at least one thin-film deposition technology through research, internships, academic projects, or industry experience
Working knowledge of statistics and Design of Experiments (DOE); able to analyze data and present findings effectively
Strong analytical and problem-solving skills, with familiarity in structured troubleshooting methodologies
Clear written and verbal communication skills; able to prepare technical reports and present results to internal and customer teams
Willingness to travel 25-50% domestically and internationally to support customer activities
Professional working proficiency in English and Chinese

What sets you apart

Experience with thin-film deposition, plasma processing, ALD, CVD, PVD, or semiconductor manufacturing
Hands-on experience with vacuum systems, gas delivery systems, or metrology tools (SEM, XRR, Ellipsometry)
Knowledge of NPI, process qualification, or HVM environments
Experience applying structured problem-solving methodologies (5-Why, Fishbone, FMEA, etc.)
Passion for advanced semiconductor technologies and continuous learning

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size: 1,001-5,000
Company stage: IPO
Headquarters: Almere, Netherlands
Founded: 1968

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