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Micron Technology

Makes memory and storage chips for AI and PCs

Advanced Packaging Technology Development Process Integrator - Advanced Packaging Technology Development Process Integrator

Process EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A PhD, Master's, or Bachelor's degree in Electrical and Electronic Engineering, Materials Engineering, Mechanical Engineering, Physics, or Applied Physics, or equivalent work experience.
  • At least 5 years of experience in the semiconductor industry.
  • Experience in backend advanced-packaging wafer- or die-level processes or integration.
  • Understanding of silicon integration and its interaction with backend processes and package level through CPI.
  • Proficiency with simulation tools and data analytics platforms for performance analysis and optimization.
  • Strong project management skills to ensure execution to timelines.
  • Ability to integrate and cooperate with people from cross-functional teams.
  • Ability to integrate artificial intelligence into daily tasks and leverage artificial intelligence or agents for assigned projects.

Responsibilities

  • Develop advanced packaging process solutions and ensure the success of new process, new equipment, new material, and pathfinding activities for advanced-packaging products.
  • Lead or contribute to new-technology-node process readiness and improve yield, quality, and reliability through process characterization, optimization, and introduction of new materials, machines, and technologies.
  • Enable the best technology for new technology nodes while meeting packaging requirements, and drive collaboration with cross-functional teams to resolve process-related problems.
  • Ensure a smooth transition from new process development through first qualification success to small-volume production launch.
  • Develop and qualify new packaging processes, materials, equipment, and technology solutions to meet new technology-node requirements and schedules.
  • Perform CPI NUDD, process TRA, silicon characterization, risk-mitigation execution, and process-recipe readiness before silicon arrives, and ensure first-pass rate.
  • Qualify new processes, technologies, equipment, and materials.
  • Identify pathfinding opportunities that support technology leadership, time to market, continuous yield improvement, cost efficiency, and touchpoint optimization.
  • Integrate process knowledge between upstream and downstream silicon and assembly/packaging processes.
  • Assess future trends, technologies, and capabilities required for future packaging solutions, and work with teams to establish new capabilities for integration.
  • Provide new solutions on time to meet company and customer needs.
  • Develop and engage creative solutions for new capabilities or to overcome identified process constraints ahead of product requirements.

Desired Qualifications

  • Experience in frontend fab process integration or module processes.
  • Experience in temporary or permanent bonding technology, including wafer-on-wafer and chip-on-wafer.
  • Strong communication and presentation skills.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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