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GlobalFoundries

Semiconductor foundry delivering specialized chips

PMTS Application Engineering - Mips

Full-Time
No salary listed
Senior
Bachelor's, Master's
Seoul, South Korea
In PersonTravel up to 30% within Japan.
Solution EngineeringPre-Sales Solution Engineering

About the job

Requirements
  • A Bachelor of Science in Electrical Engineering is required; a Master of Science in Electrical Engineering is preferred.
  • At least 7 years of relevant experience in system-on-chip or application-specific integrated circuit design and architecture.
  • Good understanding of reduced instruction set and digital signal processor architectures.
  • Good communication and presentation skills, with experience working with customers in a presales process.
  • Willingness to travel up to 30% within Japan.
Responsibilities
  • Act as the primary technical interface for customers during presales and early development phases.
  • Support customer engineering teams in evaluating and adopting MIPS solutions.
  • Provide hands-on technical guidance on processor intellectual property integration, software toolchains, development environments, and system architecture considerations.
  • Support technical discussions to secure project and design wins for processor intellectual property licenses, software tools, and custom silicon programs and solutions, and assist customers in transitioning from evaluation to design execution.
  • Help customers understand and use MIPS’ value proposition, including its RISC-V processor intellectual property portfolio, open RISC-V architecture flexibility, multi-threaded high-performance computing, functional safety-ready solutions, and system-level configurations for optimized performance, power, area, and cost.
  • Troubleshoot and resolve customer technical issues across hardware and software domains during the presales engagement phase.
  • Work closely with internal engineering teams to address and resolve complex challenges during the presales engagement.
  • Ensure timely resolution of customer issues to maintain momentum.
  • Partner with Business Development to support opportunity creation through closure.
  • Provide technical input to evaluations, proposals, requests for information, and customer presentations.
  • Translate customer requirements into actionable feedback for product and engineering teams.
  • Support engagement with ecosystem partners in software, electronic design automation, and design services.
  • Participate in customer workshops, demonstrations, and industry events.
  • Help position MIPS solutions within the broader semiconductor ecosystem in Japan.
Desired Qualifications
  • Experience across multiple stages of a system-on-chip design, from architecture definition through register-transfer-level coding in Verilog and synthesis to physical design.
  • Hands-on experience in embedded system design, debugging, or firmware/software development.
  • Understanding of digital signal processing algorithms for wireless communication, LiDAR/RADAR, image processing, and advanced sensors.
  • Understanding of artificial intelligence and machine-learning-based system design and use-case requirements.
  • Understanding of system-on-chip design requirements for automotive functional safety.
  • Understanding of security concepts and standards-based building blocks for secure system-on-chip design.
  • Good written and verbal communication skills, and the ability to break down complex problems into manageable tasks.
  • Ability to communicate technical information in meetings, presentations, seminars, product demonstrations, and customer training, and to provide guidance to the sales team.

About the company

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company Size

10,001+

Company Stage

IPO

Headquarters

Town of Malta, New York

Founded

2009

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Simplify's Take

What believers are saying

  • Marvell expanded SiGe capacity on September 17, 2026, signaling demand through 2027.
  • Commerce finalized a $375 million R&D award on September 8, 2026, plus a July $300 million framework.
  • SMART Photonics partnered with GF on September 21, 2026, widening its photonics platform and customer funnel.

What critics are saying

  • Smart mobile is 36% of revenue, and management expects low-teens decline in 2026.
  • Tower Semiconductor litigation in Texas and the ITC risks injunctions, distraction, and patent retaliation.
  • If AI photonics demand normalizes before 2027, GF's growth story reverts to commoditized mature-node fabs.

What makes GlobalFoundries unique

  • GlobalFoundries abandoned bleeding-edge nodes in 2018, specializing in feature-rich chips for autos and connectivity.
  • Its Malta, Burlington, Dresden, and Singapore footprint sells trusted regional supply to governments and enterprises.
  • GF owns uncommon SiGe, silicon photonics, and FDX process depth for optical and edge chips.

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Benefits

  • Professional Development Budget

Growth & Insights and Company News

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Yahoo Finance
Oct 15th, 2026
US doubles GlobalFoundries stake to about 8% in deal with up to $21B Japan-backed chip plants

The US government has doubled its equity stake in chipmaker GlobalFoundries to nearly 8%, President Donald Trump announced Wednesday. He said the stake is now "worth over 2 Billion Dollars" in a company with a market capitalisation of about $27.2 billion. The deal reallocates a $955 million award under the 2022 Chips and Science Act toward modernising the company's facilities. GlobalFoundries said the government is taking an additional stake of about 4%. A new vehicle co-owned by the US and Japanese governments will fund two fabrication plants, described as "up to $21 billion" in investment, with about $10 billion initially. GlobalFoundries will build and operate them, and expects about $3 billion in compensation over the next decade. The first plant is due online in 2029, the second in 2031.

Guggenheim Partners
Oct 14th, 2026
GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative | GlobalFoundries

GF has been selected as the technology provider and operator for two new fabs at its Malta, New York, site under a U.S.-Japan initiative.

Sohu
Oct 14th, 2026
GlobalFoundries to build two New York chip plants with up to $21B from Japan, US to take 4% stake

GlobalFoundries will build two new chip factories at its existing site in upstate New York, according to a deal announced on October 14. Japan's government will provide up to $21 billion in funding. The US government will buy about 4% of the company's shares. The two plants will be jointly held by the US and Japan. The new factories will make basic chips, reducing reliance on suppliers in East Asia.

Bloomberg
Oct 14th, 2026
GlobalFoundries to build two chip plants with up to $21B in Japanese backing

GlobalFoundries Inc. plans to build two new chip plants with backing of as much as $21 billion from the Japanese government. The arrangement is part of a US-Japan deal that also includes the US taking a 4% stake in the company.

Yahoo Finance
Oct 8th, 2026
TSMC signs $2B deal with GlobalFoundries for AI chip silicon interposers at New York plant

GlobalFoundries shares rose nearly 6% Thursday after announcing a $2 billion manufacturing deal with Taiwan Semiconductor Manufacturing Company to produce silicon interposers at its New York facility. The five-year agreement will support expanded manufacturing capacity, with volume production expected to begin in the first half of 2028. The facility is set to become the first US-based source of silicon interposers for advanced packaging technologies. These components are crucial for TSMC's Chip-on-Wafer-on-Substrate technology, which connects AI processors with high-bandwidth memory. The deal addresses constraints in TSMC's CoWoS packaging capacity, which has become a bottleneck for AI chip production. Counterpoint Research estimates the supply-demand gap could remain around 20% in 2026 before narrowing to roughly 10% in 2027.