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Skorpios Technologies

Develops wafer-scale silicon photonics modules

Process Engineer - Dry Etch

Process EngineeringConfirmed live in the last 24 hours
Full-timeTemecula, CA, USA$100k - $150kIn-person

About the Job

Requirements

  • Processing experience in a fab in dry etch processing using Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), and Microwave Ashing.
  • Experience with Statistical Process Control (SPC).
  • Basic understanding of algebraic concepts.
  • Experience with data extraction, analysis, and reporting.
  • Basic understanding of semiconductor processing.
  • Ability to troubleshoot basic problems and address root causes.
  • Ability to understand maintenance activity details required to ensure a healthy and repeatable process.
  • Ability to plan and prioritize activities and perform and monitor multiple overlapping tasks and operations to meet goals and timelines.
  • Ability to operate processing tools, write and run Dry Etch recipes, inspect wafers under a microscope, and perform basic characterization related to Dry Etch processing, including particle and defect metrology and thickness and uniformity metrology.
  • Must be able to work offset shifts: Front-End Days (starts on Sundays and ends on Thursdays) or Back-End Days (starts on Tuesdays and ends on Saturdays).
  • A BS in Electrical Engineering, Material Science, Physics, or Chemistry, plus 9 years of experience; an MS plus 7 years; or a Ph.D. plus 4 years of experience.
  • Must qualify as a U.S. person under ITAR: a U.S. citizen, U.S. permanent resident, political asylee, or refugee.

Responsibilities

  • Partner with Integration Engineers, customers, and other Development Engineers to execute experiments and adjust or optimize processes for fab operation.
  • Partner with Product Engineering and Integration to help ensure effective new product and process introductions, consistent device performance, and quality.
  • Guide and assist Process Technicians through challenging process steps.
  • Analyze metrology results and disposition lots based on data and pass/fail criteria.
  • Report and summarize metrology analysis results and provide guidance to the Integration Engineering Team and Process Development Engineering Team.
  • Provide effective pass-downs to support uninterrupted operation of Dry Etch activities.
  • Sustain and improve wafer fabrication processes.
  • Partner with Equipment Engineering, Operations, and management to improve cycle time, tool availability, quality, and product yields.
  • Use Document Control, Process Work Instructions, and Manufacturing Execution Systems to preserve working knowledge of codes and standards applicable to assigned production equipment.
  • Ensure manufactured products conform to specifications and application requirements.
  • Partner with the Senior Development Engineering team and Integration teams to resolve deviations or technical issues by establishing hypotheses, defining experiments to validate or invalidate hypotheses, identifying root causes, implementing corrective actions, documenting improved processes, and training operations.
  • Sustain existing processes in Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), Microwave Ashing, Transformer Coupled Plasma etching (TCP), Dipole Ring Magnetron etching (DRM), and barrel etching; create etch process recipes; conduct inspections and defect control; and perform standard Dry Etch metrology such as ellipsometry or profilometry.
  • Create and maintain operating specifications for production processes and equipment.
  • Monitor process health with Statistical Process Control (SPC) and respond to out-of-control events according to out-of-control action plans.

About the Company

Skorpios Technologies

Develops wafer-scale silicon photonics modules

Skorpios Technologies designs and sells integrated photonics products built on a proprietary wafer-scale silicon photonics process. Its offerings include modules and components for ethernet pluggable optics, copackaged optics, Lidar, and biosensors, serving telecommunications, data centers, automotive, and healthcare markets. The technology combines lasers, modulators, and photodiodes on a single wafer to create compact, efficient devices used for data transmission and optical sensing. This approach differentiates Skorpios from competitors by using its unique wafer-scale silicon photonics architecture and in-house foundry services to deliver high-performance, densely integrated optical solutions. The company’s goal is to provide fast, reliable optical transmission and sensing technologies that meet the growing demand across multiple industries by delivering advanced photonics products and fabrication services.

Company size
51-200
Company stage
Series D
Total funding
$67.9M
Headquarters
Temecula, CA
Founded
2009

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