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Micron Technology

Makes memory and storage chips for AI and PCs

Engineer – HIG-HBM Product System & Engineering - Media Health Reliability

Quality EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listed

About the Job

Requirements

  • A Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field.
  • Experience in semiconductor devices, circuit design, or product validation is a plus.
  • A solid understanding of problem-solving methodologies, with a focus on identifying root causes and exploring solution spaces.
  • Familiarity with CMOS technology, DRAM architecture, and basic device physics.
  • Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
  • Strong attention to detail and a commitment to quality.
  • Ability to work effectively in team-based projects, contributing to shared goals and outcomes.
  • Flexibility, eagerness to learn, and willingness to take on diverse roles in a dynamic engineering environment.
  • Responsibility and accountability, with a professional work ethic and ownership of assigned tasks.
  • Clear and effective communication skills, especially when articulating technical concepts and findings.

Responsibilities

  • Define and develop reliability stress, test flows, and test plans to cover all product reliability aspects.
  • Work closely with the Global Quality team to define qualification plans, review and manage qualification execution progress, and drive resolution of qualification gating issues.
  • Drive down extrinsic reliability (Time 0 and Field DPM) and intrinsic reliability through optimized manufacturing test flows and test strategy to meet quality, cost, and cycle-time KPIs.
  • Debug and identify root causes and failures in reliability tests through electrical failure analysis and physical failure analysis, then drive resolution and improvements through cross-functional collaboration.
  • Provide recommendations to fab teams for new process conversions to reduce cost and increase yields, supporting HBM product yield, quality, reliability, and performance.
  • Communicate with Product Managers and Leads to manage risks associated with DPM process conversions.
  • Promote innovation and drive changes that provide a technical advantage over competitors.
  • Develop and mentor others.
  • Develop project management skills within the team to support efficient project execution and timely delivery of technological solutions.
  • Make final decisions on risk analysis and project prioritization.
  • Collaborate with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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