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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Assembly Process Manufacturing Engineer for Back End Fab

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeNakatsu, Oita, JapanNo salary listedIn-person

About the Job

Requirements

  • Experience as a semiconductor back-end process engineer.
  • Practical engineering experience in package sealing, stamping, or package dicing.

Responsibilities

  • Improve the productivity, quality, and yield of automotive system-on-chip products.
  • Launch the assembly line for newly developed artificial-intelligence-related power modules.

Desired Qualifications

  • Knowledge of the entire semiconductor assembly process.
  • Knowledge of image-processing inspection technology.
  • Knowledge of statistics.
  • Knowledge of quality control.
  • Presentation skills.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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