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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Forward Deployed Team Lead

Engineering LeadershipConfirmed live in the last 24 hours
Full-timeSuzhou, Jiangsu, ChinaNo salary listed

About the Job

Requirements

  • Have 5 or more years of experience in embedded artificial intelligence or robotics/advanced driver-assistance systems software deployment.
  • Have hands-on experience with model compilation, quantization, and optimization using tools such as MLIR, TVM, or TensorRT.
  • Have practical experience with agentic artificial intelligence and large language model-based development tools.
  • Have strong skills in Linux, Python, and C++, and experience with ROS 2.
  • Have customer-facing technical experience and be able to work on site with customers.
  • Have 3 or more years of experience leading engineering or field/solutions teams, with the ability to hire, mentor, and manage customer engagements across multiple accounts.

Responsibilities

  • Build and lead the China field-deployed engineering organization by hiring and developing engineers, setting priorities across accounts, defining delivery standards, and serving as the main technical partner to business leadership, customers, and global engineering teams.

Desired Qualifications

  • Experience with large language model, vision-language model, or vision-language-action models on edge devices.
  • Experience with simulation tools such as Isaac Sim or Omniverse, and hardware-in-the-loop validation.
  • Experience porting from CUDA/NVIDIA to other artificial intelligence accelerators.
  • Background in automotive systems-on-chips or functional safety.
  • Involvement in open-source, developer-community, or university collaborations.
  • Experience building a field engineering or field-deployed engineering team from scratch, and an established network in China's robotics or Physical AI ecosystem.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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