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Micron Technology

Makes memory and storage chips for AI and PCs

Product Pathfinding Engineer

Hardware Systems IntegrationPosted on Nov 2
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • Strong foundation in Electrical or Computer Engineering with proven industry experience in high-speed datapath design, logic development, and advanced circuit analysis.
  • Demonstrated ability to solve complex technical challenges using analytical, debugging, and problem-solving skills.
  • Consistent track record of delivering high-quality results and driving excellence in current and previous areas of responsibility.
  • Proven success collaborating across multifunctional teams to solve complex problems and achieve shared business objectives.
  • Excellent communication, presentation, and interpersonal skills, with the ability to influence partners and work in a highly collaborative environment.

Responsibilities

  • Develop JEDEC-HBM or alternative Near Memory DRAM solutions.
  • Implement innovative 2.5D and 3D solutions, including HBM, from electrical and packaging perspectives.
  • Serve as a key interface between Research and Development, Manufacturing, Marketing, and Quality Assurance departments.
  • Collaborate with customers, Technology Development, Test, and Manufacturing to capture key requirements and findings for next-generation product development.
  • Work with System Engineering, Component Validation, and Media Health teams to plan responses to future technology node changes and ensure adequate test coverage for the upcoming Alpha product.
  • Ensure all silicon findings are resolved within encouraged issue-closure timelines for the designs the team handles.
  • Coordinate with Build, Verification, Product Architecture, System Compatibility Group, and Silicon Strategy teams to deliver products effectively and efficiently.
  • Identify and coordinate ongoing build-readiness improvement initiatives to implement lessons learned quickly.
  • Work with the Product Leadership Team to incorporate build readiness into overall product leadership strategy and align strategies with product objectives and timelines.

Desired Qualifications

  • Demonstrated technical leadership with the ability to guide projects, influence decisions, and drive successful outcomes across engineering teams.
  • Familiarity with DRAM architecture, design, and related semiconductor technologies.
  • Strong understanding of how product yield, quality, and manufacturing efficiency affect business performance and revenue.
  • Experience collaborating with multifunctional teams across multiple geographic locations and engineering subject areas.
  • Ability to work effectively in a global, fast-paced environment while balancing technical excellence, teamwork, and business objectives.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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