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Micron Technology

Makes memory and storage chips for AI and PCs

Metallization Engineering Lead

Process EngineeringConfirmed live in the last 24 hours
Full-timeTainan City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • Five to ten or more years of experience in semiconductor process or equipment engineering.
  • Experience in wafer fabrication or outsourced semiconductor assembly and test (OSAT).
  • Proven team leadership experience, formal or informal.
  • Strong understanding of yield, statistical process control (SPC), process control, and equipment reliability.
  • Ability to work in a fast-paced, high-accountability environment.
  • Strong communication skills in cross-functional and global settings.
  • Ability to integrate AI-assisted tools and insights into daily work responsibly and in compliance with organizational standards and legal requirements.
  • Baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools for research, analysis, content creation, problem-solving, operational tasks, and business outcomes.

Responsibilities

  • Lead and develop a team of process and equipment engineers supporting high-volume manufacturing.
  • Drive process stability, yield improvement, and equipment performance.
  • Own and execute continuous improvement initiatives related to yield, cycle time, and cost.
  • Collaborate cross-functionally with production, quality, industrial engineering, and global teams.
  • Make data-driven decisions and take accountability for line performance.
  • Coach and mentor team members to develop their technical and leadership capabilities.
  • Support new technology transfer, ramp-up, and site expansion.
  • Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness while exercising sound judgment and complying with organizational standards and legal requirements.
  • Identify, test, and share AI-enabled enhancements within the scope of work.

Desired Qualifications

  • Experience in advanced-node or high-volume manufacturing.
  • Exposure to U.S. or multinational company culture.
  • Experience in ramp-up, new-site, or greenfield-fab environments.
  • Knowledge of automation, data analytics, or smart manufacturing.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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