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Tenstorrent

Designs AI chips and licenses processor cores

Datacenter Liquid Cooling Architect

Thermal & Fluids EngineeringUpdated on Nov 10
Full-time

About the Job

Requirements

  • A BS, MS, or PhD in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, or a related discipline, and 12+ years of experience in thermal engineering, liquid cooling, heat transfer, or advanced mechanical systems.
  • Experience architecting and delivering complex liquid cooling systems from concept through production, with expertise in fluid mechanics, thermodynamics, heat transfer, and thermal-hydraulic design.
  • Hands-on experience designing and optimizing cold plates, manifolds, pumps, heat exchangers, tubing, and fluid connectors for demanding thermal loads.
  • Proficiency with CFD and thermal simulation tools such as ANSYS Fluent, Icepak, or CFX, and mechanical CAD tools such as Creo, SolidWorks, or NX.
  • Ability to perform system-level flow, pressure-drop, pump-sizing, and heat-transfer calculations.
  • Ability to independently drive complex engineering programs, guide multidisciplinary teams, and take designs through validation and production.

Responsibilities

  • Architect end-to-end liquid cooling systems for AI racks operating at 400–600 kW, from accelerator cold plates and server coolant distribution through rack manifolds, pumps, CDUs, and facility interfaces.
  • Develop and qualify chip-level cooling solutions for accelerator packages dissipating 2,000–3,000 W, collaborating across silicon, package, PCB, and mechanical engineering to address hotspots, heat flux, interfaces, and mechanical loading.
  • Build and validate thermal-hydraulic models and designs, including coolant flow and temperature requirements, pressure drops, flow balancing, pump operating points, CFD analysis, and system operating margins.
  • Deliver mechanically robust, serviceable rack cooling architectures, defining requirements for coolant selection, materials compatibility, leak prevention and detection, pressure containment, reliability, maintenance, and fault tolerance.
  • Lead prototyping, testing, supplier engagement, and production implementation, correlating models with test results and delivering validated cooling hardware, CDU interfaces, and rack distribution systems.
  • Establish the liquid cooling technology foundation for next-generation AI systems operating at unprecedented compute and thermal densities.
  • Shape cooling architecture and technical roadmaps across accelerator packages, servers, racks, CDUs, and datacenter infrastructure.
  • Work with cross-functional engineering teams and cooling suppliers to evaluate emerging technologies and make system-level design decisions.
  • Take advanced cooling solutions from early architecture and analysis through full-rack validation and production deployment.

About the Company

Tenstorrent

Designs AI chips and licenses processor cores

Tenstorrent designs AI processors and computing systems for developers, enterprises and chip designers that want control over their hardware. Its Galaxy servers connect multiple AI processors to run language models, video generation and other workloads across larger systems. The company sells accelerator cards, workstations and servers, and licenses RISC-V CPU designs and Tensix AI cores for customers to incorporate into their own chips. Its software compilers translate models from popular machine learning frameworks into programs for Tenstorrent hardware. Founded in 2016, it operates from offices in the United States, Canada, Europe and Asia.

Company size
501-1,000
Company stage
Late Stage VC
Total funding
$2.8B
Headquarters
Santa Clara, CA
Founded
2016

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