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Micron Technology

Makes memory and storage chips for AI and PCs

HBM SoC Physical Design Engineer

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeRichardson, TX, USANo salary listedIn-person

About the Job

Requirements

  • Strong experience implementing SoC physical design from netlist to GDSII on advanced nodes and complex designs.
  • Proficiency with industry EDA tools such as Cadence Innovus and Tempus, Synopsys ICC2 and PrimeTime, Siemens Calibre, or equivalent.
  • Solid understanding of static timing analysis fundamentals, clocking, SDC constraints, and closure techniques such as buffering, path shaping, and useful skew.
  • Experience with power intent and power delivery considerations, including UPF/CPF concepts, power-grid planning, and power-gating implications.
  • Familiarity with physical verification and signoff concepts including DRC, LVS, ERC, parasitic-extraction awareness, and signoff handoff quality.

Responsibilities

  • Own physical implementation for SoC blocks and/or top-level designs, including floor-planning, placement, clock-tree synthesis, routing, and physical optimization to meet PPA targets.
  • Drive setup and hold timing closure across multi-mode/multi-corner scenarios, partnering with RTL, architecture, and STA/signoff teams to converge designs.
  • Integrate and implement complex IP, including controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, and PHY-adjacent logic, focusing on robust physical integration and timing and power integrity.
  • Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, and address violations efficiently.
  • Partner with DFT teams to ensure scan and MBIST requirements are physically realizable without compromising PPA or schedule.
  • Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements.
  • Support tape-out execution through checklists, ECO flows, and signoff reviews; contribute to post-silicon debug by correlating silicon behavior with physical-design, STA, and power analysis.
  • Identify flow gaps and improve productivity through scripting, automation, and best-practice methodology development.

Desired Qualifications

  • Experience with HBM/DRAM-adjacent SoC designs or memory-subsystem-heavy SoCs.
  • A bachelor's or master's degree in Electrical Engineering, Computer Engineering, or a related field.
  • A minimum of 10 years of experience in a related field.
  • Ability to mentor and develop engineers early in their careers.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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