Full-Time

HR Business Partner 4

Posted on 2/28/2026

Applied Materials

Applied Materials

10,001+ employees

Materials engineering equipment for semiconductors

Compensation Overview

$133.5k - $183.5k/yr

+ Bonus + Stock Award

Company Historically Provides H1B Sponsorship

Santa Clara, CA, USA

In Person

Category
People & HR (1)
Required Skills
Workday HRIS
Data Analysis
Requirements
  • Demonstrates depth and/or breadth of expertise in own specialized discipline or field
  • Interprets internal/external business challenges and recommends best practices to improve products, processes or services
  • May lead functional teams or projects with moderate resource requirements, risk, and/or complexity
  • Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgment and identify innovative solutions
  • Impacts the achievement of customer, operational, project or service objectives; work is guided by functional policies
  • Communicates difficult concepts and negotiates with others to adopt a different point of view
Responsibilities
  • In collaboration with manager, shape HR BU/Function strategies and priorities to align to BU/Function strategy and changing needs to help shape the appropriate culture. Diagnose and provide appropriate interventions to optimize business performance to execute against strategy goals generally at the BU/Function leadership level. Balance enterprise-wide and business unit specific needs with local requirements.
  • In collaboration with manager, conduct organizational & talent assessments; develop talent strategy and pipeline to staff and build workforce capability. (e.g., selection, assessment, development, succession)
  • In collaboration with manager, design and implement change management, communication and engagement strategies within the BU/Function.
  • Actively partner, coach & develop managers and begin to develop executive leadership. (e.g., coaching, counseling, career development, disciplinary actions, performance management).
  • Effectively leverage and partner with COE & HR Ops in the delivery of initiatives to deliver the HR strategy for BU/Function. Balance enterprise-wide and business unit specific needs with local requirements.
  • Leverage tools and systems e.g.; Workforce Dashboard, Workday to perform analytics in support of business strategy.
  • As required, participate in M,A&D diligence and integration(s) from the HR perspective. Partner with M,A&D core team and regional HR on projects, programs, processes and initiatives to integrate the acquisition with the BU/Function.
  • Participate in at least one HR enterprise/region-wide initiative annually.

Applied Materials provides equipment, software, and services for materials engineering used in semiconductor and display manufacturing. Their systems modify materials at atomic scale to enable etching, deposition, inspection, and process control across chip and display fabrication. It differentiates itself by offering end-to-end hardware, software, and services that support customers from process development to high-volume production in both markets, backed by long-standing relationships with major tech firms. Its goal is to help customers turn scientific possibilities into mass-produced, advanced electronic devices.

Company Size

10,001+

Company Stage

IPO

Headquarters

Santa Clara, California

Founded

1967

Simplify Jobs

Simplify's Take

What believers are saying

  • EPIC Center operational in 2026 accelerates AI chip R&D commercialization with Advantest.
  • NEXX acquisition expands panel-level packaging to 510x515mm for AI accelerators.
  • DRAM segment grows 34% in 2027, driving fastest revenue expansion per Wolfe Research.

What critics are saying

  • US export controls drop China revenue below 10%, causing $2B annual losses by 2027.
  • ASML High-NA EUV locks out AMAT tools, slashing orders 20-30% in 12 months.
  • Lam Research etch tools capture 25% GAA market share from Trillium ALD in 18 months.

What makes Applied Materials unique

  • Applied Materials leads in atomic-level deposition for Gate-All-Around transistors at 2nm nodes.
  • Precision Selective Nitride PECVD protects shallow trench isolation in angstrom-era chipmaking.
  • Trillium ALD enables conformal metal gate stacks for AI chip power efficiency.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

Disability Insurance

Relocation Assistance

Performance Bonus

Stock Options

Flexible Work Hours

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

0%

2 year growth

0%
MTD E-business Ltd
Apr 11th, 2026
Applied Materials unveils advanced deposition tools for the angstrom era of chipmaking!

Applied Materials unveils advanced deposition tools for the angstrom era of chipmaking! Saturday 11 April 2026, 11:04:47 AM Applied Materials is advancing the future of semiconductor manufacturing with the introduction of two new deposition systems designed to support the transition to angstrom-scale chipmaking. These innovations are aimed at enabling the production of next-generation chips at 2nm-class nodes and beyond, where precision at the atomic level becomes critical to performance, power efficiency, and yield. As the semiconductor industry moves from FinFET architectures to Gate-All-Around transistors, the complexity of chip fabrication is increasing dramatically. Advanced logic processes can now exceed 500 steps, many of which involve highly controlled deposition of materials across intricate three-dimensional structures. This shift is being driven in large part by the demands of artificial intelligence, where next-generation processors are expected to integrate hundreds of billions of transistors within extremely compact footprints. To address these challenges, Applied Materials has introduced its Precision Selective Nitride PECVD system. This platform is designed to deposit silicon nitride films with high selectivity, helping protect shallow trench isolation structures that are essential for maintaining electrical separation between densely packed transistors. By improving isolation integrity, the system contributes to reduced parasitic capacitance and enhanced overall device performance, which are increasingly important as transistor density continues to rise. The second innovation, the Trillium ALD system, focuses on one of the most critical aspects of advanced transistor design: the formation of metal gate stacks in Gate-All-Around architectures. These structures require ultra-thin, conformal layers to be deposited with extreme precision over complex nanoscale geometries. The Trillium platform enables tighter control over these layers, directly influencing key parameters such as threshold voltage and device variability. At angstrom-scale dimensions, even the smallest inconsistencies can impact chip performance and manufacturing yield, making such precision indispensable. According to Prabu Raja, President of the Semiconductor Products Group at Applied Materials, the industry is entering a phase of rapid and non-linear change where traditional scaling approaches are no longer sufficient. He emphasized that materials engineering is becoming a defining factor in determining chip performance and power efficiency at advanced nodes. The newly introduced deposition systems are positioned as critical enablers for achieving the transistor-level breakthroughs required by the AI computing roadmap. Leading foundries and logic manufacturers are already adopting these systems for 2nm-class development, underscoring the growing importance of deposition control and material precision in next-generation chip production. As semiconductor devices continue to shrink, the margin for error narrows significantly, placing greater emphasis on technologies that can deliver consistent, atomic-level accuracy. Overall, Applied Materials' latest innovations highlight a broader industry shift where materials science and deposition technology are at the forefront of semiconductor advancement. By addressing key challenges in isolation and gate-stack formation, these new systems provide a practical pathway for managing variability, reducing power consumption, and sustaining performance gains in the angstrom era of chipmaking. Want to know more? Whether it's extra details on this article or information about MTD's services, fill in this form and we'll get back to you.

Yahoo Finance
Apr 11th, 2026
Applied Materials and Caterpillar outperform as UPS faces labour costs and declining revenue

Applied Materials reported first-quarter revenue of $7.01 billion, down 2% due to falling China sales, but earnings per share surged 75% to $2.54 on improved margins. The semiconductor equipment maker expects industry sales to grow more than 20% this year, driven by AI computing demand. The company holds leading market positions in deposition and etching tools used for chip manufacturing. Its shares have risen over 175% in the past year and more than 35% year-to-date. Meanwhile, Caterpillar is benefiting from data centre growth through its dominance in backup generators. The industrial firm is experiencing strong sales growth and a large backlog for diesel and natural gas engines that provide emergency power for hyperscale data centres.

The Associated Press
Apr 8th, 2026
Applied Materials unveils deposition systems for 2nm GAA transistors with atomic-scale precision

Applied Materials has introduced two chipmaking systems designed for atomic-scale precision in manufacturing advanced logic chips at 2nm and beyond. The technologies address the complexity of Gate-All-Around transistors, which require over 500 process steps. The Precision Selective Nitride PECVD system uses selective bottom-up deposition to preserve shallow trench isolation integrity, reducing parasitic capacitance and improving chip performance-per-watt. The Trillium ALD system deposits complex metal gate stacks around silicon nanosheets with angstrom-level thickness control, enabling chipmakers to optimise transistors for various AI computing applications. Both systems are being adopted by leading foundry-logic manufacturers. The innovations help address surging demand for AI compute by enabling faster, more power-efficient transistors in processors containing hundreds of billions of transistors.

Yahoo Finance
Mar 25th, 2026
Applied Materials surges on AI-driven wafer-fab spending and foundry capex growth

Applied Materials, a semiconductor equipment supplier, was highlighted as a top contributor in RiverPark Large Growth Fund's fourth quarter 2025 investor letter. The stock rallied on improving wafer-fabrication spending visibility, with management reporting mid-teens growth in semiconductor systems revenue driven by AI-related capacity orders for advanced logic and high-bandwidth memory. Several major foundries raised their 2026 capital expenditure plans, signalling durable multi-year demand for Applied Materials' technologies. The company's installed base revenues grew at a high single-digit rate, with strength in services and spares continuing. As of 24 March 2026, Applied Materials shares traded at $373.99, with a market capitalisation of $296.8 billion. The stock gained 148.20% over the previous 52 weeks. Hedge fund ownership increased to 111 portfolios in Q4 2025 from 89 the previous quarter.

Yahoo Finance
Mar 25th, 2026
UPS opens $100M Taiwan logistics hub to serve booming semiconductor industry

United Parcel Service has opened a $100 million logistics centre in Taiwan, its largest facility in the Asia Pacific region, to meet surging demand from technology companies. The site in Taoyuan, near Taiwan's largest international airport, will serve as an Asian distribution centre for Applied Materials, the largest US semiconductor equipment maker. Around 80% of the freight handled at the facility is high-tech related, according to UPS Asia Pacific president Lauren Zhao. The expansion capitalises on Taiwan's position as home to TSMC, the world's leading contract chipmaker and dominant supplier of advanced semiconductors powering AI technologies. UPS is also considering flights to Kaohsiung in southern Taiwan, where TSMC is building a large new factory.

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