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Micron Technology

Makes memory and storage chips for AI and PCs

Dry Etch Member of Technical Staff - PD, Advanced NAND

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • Demonstrated interest in a research and development environment.
  • 6–10 years of experience in dry etch process development in research and development moving into manufacturing.
  • 4–5 years of pertinent experience in NAND, DRAM, or Logic module development, such as projects and deliveries involving multifunctional groups.
  • Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework.
  • Demonstrated leadership in problem-solving and experience managing technical projects.
  • Understanding of various types of plasma dry etch reactors, including radio frequency sources and chemistries.
  • Expertise in statistical process control and analysis.
  • Experience solving scalability problems of deep high aspect ratio silicon/dielectric etches, with a fundamental understanding of advanced conventional and unconventional tailored pulsing schemes.
  • PhD or equivalent experience in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or a related field, with a minimum of 10 years of dry etch process development experience; alternatively, a bachelor's or master's degree in these fields or a related field with a minimum of 12 years of applicable dry etch process development experience.
  • Strong computer skills, including Microsoft Office and SAS software such as JMP or similar.

Responsibilities

  • Lead development of dry etch technology and essential modules.
  • Become a dry etch area expert.
  • Develop and innovate dry etch processes to meet structural and electrical specifications.
  • Work closely with hardware teams to develop equipment roadmaps for current and upcoming NAND products.
  • Apply a mechanistic understanding of how process parameters affect outcomes.
  • Collaborate with and lead multifunctional teams to solve complex structural problems.
  • Present process and technology development plans for current and upcoming technology nodes.
  • Anticipate how future issues could arise and build mitigation plans.
  • Contribute to the Technical Leadership Program.
  • Mentor less-experienced engineers and encourage skill development within the team.
  • Work on critical modules such as high aspect ratio etches, tier-by-tier etches, word-line contacts, and staircase structures.
  • Find opportunities for collaborative solutions and drive them forward.
  • Guide other areas' technology roadmaps.
  • Lead or participate in multifunctional task force groups working toward a target.
  • Develop general expertise in other areas' process hardware or technologies.
  • Serve as a resource and guide for colleagues in dry etch technology and/or project management.
  • Provide upper management with critical updates on project status and impacts.
  • Lead supplier head-to-heads.

Desired Qualifications

  • Data science basics, Python coding, or AI coding experience is preferred.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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