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Teledyne

Manufactures sensors, imaging systems, and avionics

Cross Functional Assembler

Product AssemblyConfirmed live in the last 24 hours
Full-timeRancho Cordova, CA, USA$39k - $52kIn-person

About the Job

Requirements

  • Manual dexterity and the ability to work with small components are required.
  • Basic soldering skills and willingness to learn advanced techniques are required.
  • Ability to read and interpret technical drawings and instructions is required.
  • A high school diploma and vocational or technical training are required.
  • Zero to two years of experience in electronic assembly or a related field is listed as an advantage.
  • Must be a U.S. Person, including U.S. citizens, lawful permanent residents, refugees, and asylees.

Responsibilities

  • Assemble electronic and electromechanical components such as power supplies, modules, cable harnesses, and printed circuit boards.
  • Solder and desolder through-hole and surface-mount components using soldering iron and hot-air techniques.
  • Install and remove discrete components such as resistors, capacitors, and transistors on printed circuit assemblies.
  • Follow production drawings, schematics, and work instructions to complete assemblies.
  • Use hand tools and small power tools for component placement and wiring.
  • Inspect parts and perform basic tests to ensure quality standards.
  • Rework and repair defective units as needed.
  • Maintain a clean, organized work area and follow safety procedures.

About the Company

Teledyne

Manufactures sensors, imaging systems, and avionics

Teledyne Technologies designs and makes sensors, cameras, and electronics used in aerospace, environmental monitoring, medical imaging, and defense. Its products include digital imaging sensors, high-reliability cameras, instrumentation, aerospace and defense electronics, and engineered systems that provide integrated sensing solutions for demanding environments. The company grows by acquiring specialized high-tech firms, building a diversified portfolio that serves markets with high barriers to entry. Its goal is to expand capabilities and market reach through targeted acquisitions while delivering reliable sensing and imaging technology for critical industries.

Company size
11-50
Company stage
IPO
Headquarters
Thousand Oaks, CA
Founded
1960

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