MTS Module Engineer
GlobalFoundries
MTS Module Engineer
GlobalFoundries
Semiconductor foundry delivering specialized chips
About GF
GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high-performance solutions for high growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity, and sustainability. For more information, visit www.gf.com.
Introduction:
Globalfoundries Singapore is seeking highly skilled and motivated Experienced Member of Technical Staff (MTS)/Principal Process Engineer, to become part of our starting 300mm Advance Packaging Center, Singapore.
The primary responsibilities of this position are to develop and/or optimize unit processes to set up Advance Packaging related process (bond & Debond, pre-bond - Plasma / UV / cleaning process, Die re-constitution, annealing & TSV) on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level), do troubleshooting for process and tool issues. Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing.
Job Responsibilities:
Designing, executing, and analyzing experiments to develop advanced packaging etch processes to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. process stability, cost of ownership) targets.
Startup and qualify new process and new equipment within scheduled timeline. Work closely with Equipment Engineer on new equipment acceptance and tool matching. Understand the concept of repeatability and reproducibility (R&R) run.
Improve process robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills. Use lean manufacturing and six sigma processes.
To work closely with equipment team to improve equipment productivity indices
Resolve complex technical issues in own Module or yield related issues.
Support the Integration team and Quality organization to ensure technology meet the qualification and reliability requirements.
Sustain and improve process / SPC to meet quality, cost, productivity requirements
To coach and develop other engineers on advance packaging Etch processes knowledge.
Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
Related manufacturing and development experience is requested.
Required Qualifications:
BS degree or Master's Degree or PhD in Electrical Engineering, Material Science & Engineering, Chemical Engineering, Physics, or other relevant engineering discipline is required
4+ (PhD), 6+ (MSc), 8+ (BSc) years working experience in advanced packaging industry
Required experience of Leading Fab wide cross modules process development and projects coordination. Hands-on experience in advanced packaging (Si interposer, D2W, W2W) process tools.
Excellent verbal and written communication skills.
Strong interpersonal skills and ability to work effectively with different cultures.
Conduct regular meetings with PI & UMD for knowledge learning, with yearly projects that improve quality, cost, yield, or productivity. Cost reduction
Take charge of group development and needs
GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.
As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.
All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.
No Recruitment Fee Policy: GlobalFoundries is committed to ethical and transparent hiring practices. Candidates will not be charged any fees at any stage of the recruitment process. Any request for payment related to a GlobalFoundries employment opportunity is unauthorized and should be reported immediately. All legitimate recruitment communications are conducted exclusively through official GlobalFoundries channels. To report concerns or suspected recruitment fraud, please contact our Ethics & Compliance Office at [email protected] or visit our official website.
The Ethics & Compliance mailbox is not a recruitment channel. CVs/resumes submitted to this mailbox will not be reviewed, processed, or considered for employment opportunities. Please apply through the official GlobalFoundries careers site only.
Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia
Semiconductor foundry delivering specialized chips
GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.
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