Black Semiconductor develops chips that combine graphene-based photonics with traditional electronics to enable optical chip-to-chip communication. Its process embeds optical components into the outer layers of CMOS-like chips, allowing electrons to be converted to photons and back via graphene acting as a translator. This integration aims to overcome interconnect bottlenecks, enabling multiple chips to act as a single faster, more energy-efficient system for AI hardware, data centers, HPC, and autonomous driving. The company plans wafer-scale fabrication with a 300mm FabONE in Aachen, targeting pilot production by 2027 and mass production by 2031, supported by European funding and equity investors.
Company Size
51-200
Company Stage
Growth Equity (Non-Venture Capital)
Total Funding
$287.4M
Headquarters
Aachen, Germany
Founded
2020
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