B

Black Semiconductor

Graphene photonics enable optical chip interconnects

Graphene Device Physics Modeling Expert

Hardware EngineeringConfirmed live in the last 24 hours
Full-timeAachen, GermanyNo salary listedHybrid

About the Job

Requirements

  • PhD in Physics, Materials Science, Electrical Engineering, or a related field.
  • Strong foundation in solid-state physics, semiconductor physics, and mathematics.
  • Proficiency in modeling techniques and methodologies for semiconductor physics.
  • Proven ability to translate scientific literature and mathematical models into simulation code.
  • Experience with technology computer-aided design development.
  • Proficiency in Python and Git.
  • Experience solving partial differential equations, particularly for charge and heat transport.
  • Experience with graphene and photonics.

Responsibilities

  • Research the literature on state-of-the-art approaches to graphene device modeling and simulation.
  • Work with commercial technology computer-aided design and multiphysics simulation tools.
  • Translate physical models from scientific literature into robust, maintainable Python code.
  • Develop and extend models for graphene-based photonic devices, incorporating new physical effects and functionalities.
  • Calibrate, validate, and refine models using experimental characterization data.
  • Collaborate closely with various teams, prioritizing modeling activities in line with team and company goals.
  • Document work clearly and contribute to shared software-development practices.

Desired Qualifications

  • Experience with commercial simulation tools such as COMSOL Multiphysics or Ansys Lumerical.

About the Company

Black Semiconductor

Graphene photonics enable optical chip interconnects

Black Semiconductor develops graphene-based photonics that integrate optical components into the outer layers of CMOS-like chips, enabling direct optical chip-to-chip communication. It works by using graphene as a translator to convert electronic signals to optical signals and back, so electrons on silicon can talk to photons through integrated photonic interconnects. This approach differs from traditional silicon photonics or pure electronic interconnects by being CMOS-compatible, wafer-scale, and capable of linking multiple chips as a single high-performance unit while reducing production steps by about 60%. The company aims to move from pilot production to mass manufacturing, building a 300mm wafer facility (FabONE) in Aachen, with pilot production by 2027 and mass production by 2031, backed by a large European funding round and investors.

Company size
51-200
Company stage
Series A
Total funding
$287.4M
Headquarters
Aachen, Germany
Founded
2020

Recently Posted Jobs

Explore more opportunities at Black Semiconductor

See more jobs