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Nexthop.ai

AI-driven cloud networking hardware and software

Senior Signal Integrity Engineer

Board & Electronics DesignConfirmed live in the last 24 hours
Full-timeSanta Clara, CA, USANo salary listed

About the Job

Requirements

  • A Master of Science or PhD in Electrical Engineering, Physics, or a related field, or a Bachelor's degree with equivalent depth.
  • 10–15 years of signal integrity experience on high-speed system design.
  • A proven track record owning signal integrity for complex boards through production, ideally high pin-count, high-power ASIC designs at 50G per lane or above.
  • Deep expertise in 3D electromagnetic simulation and extraction using HFSS, SIwave, Sigrity, ADS, or equivalent, including model correlation to measurement.
  • Command of differential and mixed-mode S-parameters, mode conversion, crosstalk attribution, and time-domain analysis, including the physics behind anomalies.
  • Experience with link budgeting and compliance methodology for high-speed Ethernet, including COM, ERL, IEEE 802.3ck, IEEE 802.3dj or comparable standards, and C2M channel definition.
  • Hands-on knowledge of PCB stackup design, low-loss materials, fabrication process capability, and process variation.
  • Strong Python skills for simulation automation and large-scale data analysis.
  • Ability to design and validate via and launch structures against measured data, not just simulation.
  • High-speed measurement and de-embedding experience, including fixture design and calibration strategy.
  • Ability to critically review layouts and give layout and hardware engineers actionable, prioritized feedback.
  • Ability to explain channel risk to ASIC vendors, layout engineers, and executives.
  • Sound engineering judgment under schedule pressure, with a clear view of technical risk and tradeoffs.

Responsibilities

  • Own signal integrity end to end for one or more switch platforms, including pre-layout feasibility, channel architecture, simulation sign-off at design release, and link-performance debugging through EVT and DVT.
  • Set high-speed channel targets and loss budgets for links at 224G PAM4 per lane and beyond, and defend them against ASIC SerDes capability, module requirements, cost, and manufacturability constraints.
  • Drive interconnect design problems including ASIC BGA escape design, connector launch optimization, via tuning, sequential lamination and backdrill strategy, and cascade behavior across the full channel.
  • Own stackup and material strategy with PCB fabrication vendors, including laminate selection, Dk/Df modeling, impedance and loss coupon coverage, multi-vendor alignment, and DFM closure.
  • Run compliance and link analysis using COM, ERL, and evolving IEEE 802.3dj metrics for C2M and C2C channels across the supported module ecosystem.
  • Lead correlation between simulation, coupon data, and system measurement using VNA, TDR, high-speed scopes, BERT, and ASIC built-in SerDes diagnostics, and drive root cause when results disagree.
  • Work directly with ASIC, connector, and package vendors on models, launch geometry, and specifications, and hold them to required deliverables.
  • Improve team methodology through Python simulation automation, reusable analysis flows, routing and via design rules, and SI requirements for hardware and layout partners.
  • Mentor junior SI engineers and review their analysis.
  • Participate in hiring.
  • Provide hands-on lab correlation and bring-up work with regular onsite presence.

Desired Qualifications

  • Experience with 224G PAM4 or 200G-per-lane channel design.
  • Participation in IEEE 802.3 or OIF standards work.
  • Experience with cabled and optical module ecosystems, including OSFP, QSFP-DD, DAC, ACC, AEC, LPO, or LRO.
  • Power integrity or EMC experience alongside signal integrity.
  • Experience building an SI methodology or team from an early stage.

About the Company

Nexthop.ai

AI-driven cloud networking hardware and software

Nexthop AI develops networking hardware and software designed for AI-driven cloud infrastructure. Its products combine specialized routers and software that optimize data-center networks for AI workloads, built through close co-development with large cloud operators. The company works by partnering with hyperscalers to tailor and deploy scalable networking solutions, rather than selling generic gear. This approach sets Nexthop AI apart from competitors by focusing on deep, collaborative development with cloud providers and delivering integrated hardware-software systems that fit specific AI cloud needs. The goal is to meet the rising demand for advanced cloud infrastructure by delivering efficient, scalable networking solutions through strategic partnerships and joint development.

Company size
201-500
Company stage
Series B
Total funding
$610M
Headquarters
Santa Clara, CA
Founded
2024

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