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Micron Technology

Makes memory and storage chips for AI and PCs

Design Engineer Intern - High Bandwidth Memory

Silicon & ASIC DesignConfirmed live in the last 24 hours
Internship · Winter 2026Richardson, TX, USANo salary listedIn-person

About the Job

Requirements

  • Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
  • Completed coursework in Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices, or related subjects.
  • Demonstrated understanding of combinational and sequential logic design concepts.
  • Experience with Verilog, SystemVerilog, or VHDL through academic, research, or project work.
  • Programming experience in Python, Perl, Tcl, C, C++, or similar languages, with strong analytical and problem-solving skills.

Responsibilities

  • Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools.
  • Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities.
  • Develop scripts, automation solutions, and AI-assisted workflows to improve design productivity, debug efficiency, and design-flow quality.
  • Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliverables.
  • Document technical work, experimental results, AI-enabled insights, and design methodologies to support knowledge sharing and continuous improvement.

Desired Qualifications

  • Knowledge of memory architectures such as DRAM, SRAM, DDR, LPDDR, or HBM.
  • Experience with RTL design, simulation, synthesis, timing analysis, verification methodologies, or functional coverage concepts.
  • Familiarity with Linux/Unix environments, scripting, and automation techniques.
  • Exposure to semiconductor EDA tools such as VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso, or similar platforms.
  • Previous academic, research, or internship experience related to VLSI, ASIC, FPGA, semiconductor design, or applying AI to engineering workflows and analysis.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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