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Upscale AI

High-performance AI networking hardware and software

Principal Mechanical Design Engineer

Design EngineeringConfirmed live in the last 24 hours
Full-timeSanta Clara, CA, USA$227k - $244k /yr

About the Job

Requirements

  • A bachelor's degree in mechanical engineering is required.
  • At least 15 years of experience in network enclosure system design is required.
  • A proven track record of leading and delivering high-quality, low-cost complex design solutions is required.
  • Proficiency in SolidWorks and PDM CAD software is required.
  • Expertise in Design for Manufacturing and Design for Assembly principles is required.
  • Understanding of manufacturing processes, including injection molding, sheet metal fabrication, and machining, is required.
  • Understanding of estimated mechanical enclosure part and hard tooling costs is required.
  • Ability to manage multiple projects simultaneously and prioritize tasks and resources effectively is required.
  • An understanding of the full thermal development process, including feasibility, simulations, system thermal profiling, and fan policy, is required.

Responsibilities

  • Lead mechanical design work and collaborate cross-functionally with hardware engineers and operations to develop high-quality, low-cost system design solutions.
  • Work closely with hardware electrical, signal integrity, mechanical and thermal engineering peers, operations teams, contract manufacturers, and mechanical enclosure suppliers.
  • Apply understanding of liquid ORV3-cooled system design and complex thermal requirements, including heatsinks, custom cold plates, manifolds, and advanced thermal solutions.
  • Lead and mentor less experienced mechanical design engineers and provide technical guidance and problem-solving expertise.
  • Perform mechanical development across feasibility, hand calculations, trade studies, conceptual computer-aided design, detailed design files, prototyping, testing, and final production release.
  • Collaborate with electrical engineering, software, manufacturing, and product management teams to ensure product integration and success.
  • Apply part drawing standards and tolerancing practices and the overall product development process.
  • Identify and implement technologies and tools to enhance design capabilities and efficiency.
  • Address product compliance system requirements and relevant industry test standards.
  • Determine product test setups and non-operational vibration and shock test limits to ensure product quality.
  • Present detailed system design and thermal reviews across the new product introduction team.
  • Conduct and participate in team whiteboard discussions.
  • Work with mechanical suppliers to understand manufacturing capabilities and deliver high-quality, low-cost part designs.
  • Share sustaining engineering work and support as needed.
  • Travel domestically and/or internationally to support supplier parts and assembly first article inspection approvals; support the contract manufacturing partner onsite during early development, quality assurance, and first customer shipment builds.

Desired Qualifications

  • A strong design background in network equipment is preferred.
  • Hands-on lab experience in mechanical or thermal problem-solving, including periodic support for small system builds during early development, is preferred.
  • Experience with rapid prototyping techniques is preferred.
  • Strong collaboration skills are preferred.

About the Company

Upscale AI

High-performance AI networking hardware and software

Upscale AI builds a full-stack, high-performance AI networking platform to scale up GPU compute. It designs purpose-built silicon chips and a software orchestration layer that connects thousands of GPUs into a single, unified compute engine. The system is optimized for the heavy data movement and bursty traffic of large language model training and inference, enabling fast, scalable AI workloads. Unlike traditional, vendor-driven networking stacks, Upscale AI offers open-standard networking powered by silicon and software, and participates in consortia like UEC and SONiC to ensure interoperability across different hardware environments. Its customers include global hyperscalers, AI-first enterprises, and sovereign cloud providers who need large-scale, interoperable AI clusters without lock-in. The company’s goal is to democratize AI infrastructure by delivering high-performance, open-standard solutions that let organizations build and operate massive AI clusters more efficiently.

Company size
201-500
Company stage
Series A
Total funding
$490M
Headquarters
Santa Clara, CA
Founded
2024

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