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Micron Technology

Makes memory and storage chips for AI and PCs

Dry Etch Module Technical Staff-MTS/SMTS

Process EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A Ph.D. or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
  • A minimum of 10 years of hands-on experience in Dry Etch process development, preferably in DRAM or advanced memory technologies.
  • A proven track record of technical leadership in semiconductor process engineering.
  • A deep understanding of plasma etch mechanisms, process control, and defect mitigation.
  • Experience with advanced etch tools such as Lam, TEL, or AMAT and process characterization techniques.
  • The ability to lead cross-functional teams and manage complex projects.

Responsibilities

  • Lead the development, characterization, and optimization of Dry Etch processes for advanced DRAM structures.
  • Collaborate cross-functionally with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability.
  • Define and execute technical roadmaps aligned with DRAM scaling requirements and yield improvement goals.
  • Evaluate and implement new etch technologies, chemistries, and hardware platforms.
  • Mentor and guide developing engineers and foster a culture of innovation and technical excellence.
  • Collaborate with equipment vendors and external partners to co-develop solutions.
  • Drive root cause analysis and continuous improvement initiatives for process-related issues.
  • Present findings and recommendations to executive leadership and global teams.

Desired Qualifications

  • Experience with high aspect ratio etching, critical dimension control, and selectivity challenges in DRAM.
  • Familiarity with data analytics, Design of Experiments (DOE) methodologies, and Statistical Process Control (SPC) tools.
  • Knowledge of integration challenges in sub-20nm DRAM nodes.
  • Experience and/or interest in developing Agentic AI workflows into current or future processes.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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