Intern – CXL Memory Solutions

SK hynix hosts first Partners Day in Japan to strengthen chip supply chain. Published: Nov. 1, 2026 - 11:03:28 Lim Ye-jin SK hynix brought together more than 20 Japanese semiconductor suppliers at its first Partners Day in Japan, seeking closer cooperation on advanced chip technologies and supply chain stability as artificial intelligence-driven memory demand surges. The event, held Thursday in Chiba prefecture, brought together major Japanese materials suppliers Shin-Etsu, Sumco, JSR and Namics; equipment-makers Tokyo Electron and Screen Holdings; and chip processing and testing specialists Disco and Advantest. While SK hynix has held annual supplier gatherings in Korea, this was its first in Japan, underscoring the growing importance of Japanese partners in its push to expand advanced memory production. SK hynix Chief Production Officer Lee Byung-Ki attended alongside Vice President Kang Yu-jong, head of procurement, and Vice President Choi Woojin, head of packaging and testing. The chipmaker shared its medium- to long-term business strategy and technology road map, giving suppliers an early look at future demand and development priorities to help them plan investments and secure production capacity. Lee Hyunchul, vice president and head of procurement strategy, outlined the company's business outlook, while Lee Sunghoon, vice president and head of R&D process, presented its technology development plans. "Korea and Japan have a complementary relationship," Lee Byung-Ki said, stressing that closer cooperation would strengthen technological competitiveness and support both countries' semiconductor industries. Kang emphasized the need for tighter coordination with materials, components and equipment suppliers to tackle next-generation chipmaking challenges and ensure stable production. Tokyo Electron Chief Operating Officer Hiroshi Ishida said early access to SK hynix's technology road map would help suppliers make investment and development decisions. He pledged closer collaboration from the initial stages of technology development as AI makes memory chip manufacturing increasingly complex. [email protected]

CXMT answers Micron's case against 4F[2] DRAM, says first 4F[2] samples ship by year-end. Published: October 31, 2026 Want to read in a language you're more familiar with? CXMT says its sixth-gen DRAM platform is built on 4F[2] and has passed engineering-sample checks, and responds to Micron's argument that capacitor pitch, not cell layout, limits density. ChangXin Memory Technologies (CXMT) has answered Micron's argument that the 4F[2] DRAM cell layout brings no real density gain. In an investor relations record published on October 31, CXMT said its next process platform, the sixth generation, is built on 4F[2] and has already passed engineering-sample verification, Yicai reported. The first 4F[2] product will sample to customers by the end of this year, and volume production will follow customer validation and market demand. The argument is about what limits DRAM bit density. Micron President and Chief Technology and Products Officer Scott DeBoer said at the company's technology webinar on October 21 that Micron will stay on the 6F[2] path and develop 3D DRAM instead. He said Micron had studied 4F[2] for more than 20 years and found no workable scaling path, and he called parts of the 4F[2] debate a smokescreen. In his view, capacitor pitch and capacitor size, not how the transistor is laid out, set the theoretical density limit. CXMT did not dispute the physics. It called higher bit density a complex system problem, with word lines, bit lines and capacitor structures all competing for space. At a given node, it said, each architecture has its own cost curve in process integration complexity, the number of lithography steps and thermal budget. Memory makers choose differently based on their technology history, existing fab lines, patent portfolios and spending structure, and those choices deserve understanding and respect, the company said. Samsung and SK hynix are still developing 4F[2], according to a November 1 analysis carried on QQ News. Samsung showed a 16Gb 4F[2] prototype at ISSCC 2026 that combines vertical channel transistors with wafer-to-wafer hybrid copper bonding. It plans to use 4F[2] across its 10a, 10b and 10c nodes before moving to 3D DRAM at 10d, and its semiconductor CTO Song Jai-hyuk said on October 12 that 4F[2] work continues. SK hynix is taking a vertical-gate route that it says improves bit density by more than 20%. It verified read and write operations on test arrays in July and plans a capacitorless 4F[2] paper at IEDM in December. CXMT's version uses what the analysis calls a Vertical Surrounded Gate (VSG) transistor. The company says it has worked on 4F[2] since it was founded and holds more than 300 published patent families on the technology. Because 4F[2] raises density by changing the cell layout rather than shrinking line widths, it brings the area factor from 6 down to 4 at dimensions that DUV lithography can reach. CXMT has said a DDR5 RDIMM combining 4F[2] with hybrid bonding will arrive around year-end. The analysis cautions that server modules have strict reliability requirements, so the first generation will mainly serve to validate the technology.

MEXC reports 88% growth in ai-related tokenized U.S. Stock and ETF trading volume in September, with four infrastructure sectors up over 90%. Last Updated: October 29, 2026 10:11 am 4 mins read Mutsamudu, Comoros, October 29, 2026 - MEXC, a pioneer in 0-fee digital asset trading, has released its September TradFi trading data. Tokenized U.S. stock spot trading volume rose 81% month over month, while trading volume for AI-related assets grew 88%. Semiconductor- and memory-related assets accounted for 77% of trading volume among the top 10 Stock and Index Futures, while Pre-IPO Futures trading volume increased 60%. AI trading expands beyond chips into optical communications and power, with four sectors each growing over 90%. In September, trading volume for AI-related assets within MEXC's tokenized U.S. stocks and ETFs rose 88% month over month, outpacing the 63% growth recorded by non-AI assets. AI-related assets accounted for 48% of tokenized U.S. stock and ETF spot trading volume, up from 44% in August. Trading activity in AI-related assets extended beyond chips to optical communications, power equipment, and data center infrastructure. Trading volume in semiconductors and memory rose 100% month over month, followed by optical communications and networking at 99%, power and energy equipment at 96%, and computing infrastructure and data centers at 91%. All four sectors recorded growth of more than 90%. AI-related companies accounted for six of the top 10 most-traded tokenized U.S. stock and ETFs in September, reaching 59% of the ranking's combined volume. Crypto-related companies held the remaining four spots, contributing 41%. Assets associated to AI cloud services, chip design, computing infrastructure and data centers together accounted for 38% of the top 10's combined trading volume, underscoring the concentration of trading activity in AI infrastructure and crypto-related assets. Memory stocks lead Futures trading, with Semiconductor and memory assets accounting for 77% of top 10 volume. In September, semiconductor- and memory-related assets occupied five of the top 10 spots by MEXC Stock and Index Futures trading volume, contributing 77% of the ranking's combined volume. Micron (MU), SK hynix, and Sandisk (SNDK) took the top three spots, together accounting for 67% of the top 10's volume. The Direxion Daily Semiconductor Bull 3X Shares (SOXL) and NVIDIA also ranked among the top 10. Trading activity in Stock and Index Futures remained heavily concentrated in semiconductor and memory assets. Elsewhere, trading volume for the SPDR S&P 500 ETF Trust (SPY) rose 298% month over month, while Bitcoin treasury company Strategy (MSTR) recorded 147% growth. AI hardware stocks also record notable growth: Futures trading volumes for Dell (DELL) and AMD rose 243% and 209%, respectively. AMD's tokenized spot trading volume also increased 153%, with both Spot and Futures volumes more than doubling. Pre-IPO Futures trading volume rises 60%, Japanese Stock Futures grow 47%. MEXC continued to expand its global stock trading coverage in September. The number of TradFi Futures trading pairson MEXC increased 15% month over month. Pre-IPO and Japanese Stock Futures trading volumes rose 60% and 47%, respectively, making them key areas of growth during the month. MEXC also introduced a dedicated section for Taiwanese stocks, further expanding its coverage of Asian equity markets. Pre-IPO Futures were the fastest-growing TradFi Futures category during the month. Kimi (Moonshot AI) trading volume rose 115% month over month, followed by Enflame at 99% and OpenAI at 51%. September also saw the addition of Pre-IPO Futures for Polymarket, YMTC (Yangtze Memory Technologies), and Oura (Oura Health), extending coverage across prediction markets, semiconductor memory, and wearable technology. From private companies to global equity markets, MEXC is bringing trading opportunities across markets, listing stages, and product formats to a single platform. MEXC currently offers more than 450 Stock and Index Futures trading pairs, over 200 tokenized U.S. stocks, and RealStocks, which provides access to more than 7,000 U.S. stocks and ETFs. Combined with 0-fee trading, this range gives users greater flexibility to access global trading opportunities without being limited to a single market or trading method. MEXC CEO Vugar Usi said, "September's data shows that demand for AI-related trading is expanding beyond chips into the broader value chain. For trading platforms, the challenge is not simply to expand asset coverage, but to adapt to users' evolving trading needs. MEXC will remain focused on our users, continuously improving our products and trading experience to reflect emerging market trends, and make new opportunities more accessible." About MEXC Founded in 2018, MEXC is a leading global multi-asset trading platform built as your 0-fee gateway to infinite opportunities. Serving users across 170+ markets, MEXC provides simple and efficient access to crypto, stocks, tokenized assets, derivatives, and a growing range of TradFi-linked opportunities through one account and one gateway. With 0 trading fees, deep liquidity, broad asset coverage, and a high-performance trading experience, MEXC is designed for retail users who want to discover earlier, act faster, and trade with fewer barriers. As crypto and traditional finance continue to converge, MEXC is committed to making global opportunities more accessible, helping users trade freely and MEXCmize every opportunity. For media inquiries, please contact MEXC PR team: [email protected] Risk Disclaimer: This content does not constitute investment advice. Given the volatility of financial markets, including digital assets, tokenized assets, and traditional financial products, investors should carefully assess market conditions, underlying asset fundamentals, and potential financial risks before making any investment or trading decisions. BlockmanPR is a crypto PR and media agency that has been putting Web3 brands in front of global audiences since 2020. From press release distribution across 300+ crypto and mainstream outlets to Tier-1 placements, exchange PR, KOL campaigns and paid media, the agency runs every channel from a single desk. 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