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Allegro MicroSystems

Semiconductor sensing and motion control solutions

Lead Engineer - Packaging Project

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeParañaque, Metro Manila, PhilippinesNo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree (BS) in an engineering field such as Electronics and Communication Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Industrial Engineering, Manufacturing Engineering, or Metallurgical Engineering.
  • At least five years of experience in semiconductor packaging and assembly engineering, including a proven track record of technical project management and decision-making.
  • Demonstrated expertise in semiconductor packaging and assembly processes, with the ability to make design and process engineering decisions.
  • A strong understanding and practical application of project management principles, emphasizing technical leadership.
  • Proficiency in Microsoft Excel and Microsoft PowerPoint.
  • Fluency in written and spoken English.

Responsibilities

  • Manage and execute assigned packaging projects, ensuring completion on time, within budget, and within scope.
  • Participate in bill of material selection and make recommendations based on technical requirements and project objectives.
  • Develop and execute qualification plans, ensuring necessary tests and data are collected.
  • Provide engineering disposition on reliability test concerns.
  • Perform detailed assembly data and qualification data reviews, identifying issues and proposing solutions.
  • Contribute to technical discussions on package design and assembly process improvements.
  • Track critical tasks and milestones, proactively identifying and addressing potential delays or issues.
  • Identify, document, and escalate project risks and minor resource conflicts to the Technical Project Manager.
  • Collaborate with design, product line, manufacturing, and quality teams to ensure project execution.
  • Ensure project deliverables adhere to Advanced Product Quality Planning requirements and internal documentation procedures.
  • Participate in problem-solving activities, including Ishikawa (Fishbone) or 8D analyses, when project issues arise.
  • Use quality tools including Design Failure Mode and Effects Analysis (DFMEA), Process Failure Mode and Effects Analysis (PFMEA), Ishikawa, Design Review Based on Failure Mode (DRBFM), Design for Manufacturability, Design for Quality, and Design for Cost.
  • Maintain project documentation, including schedules, budgets, and technical specifications.
  • Conduct familiarization training for new personnel with similar job functions.
  • Prepare weekly and monthly project and activity highlights, and monitor projects and activities.
  • Perform other related duties as assigned by the immediate superior.

About the Company

Allegro MicroSystems

Semiconductor sensing and motion control solutions

Allegro MicroSystems designs, manufactures, and sells semiconductor products that sense, regulate, and drive electromechanical systems, focusing on power and sensing for motion control and energy-efficient applications. Its products include sensors, power-management ICs, motor-drive ICs, and related algorithms used by automotive OEMs and industrial customers worldwide. The company differentiates itself through global engineering and manufacturing capabilities, a broad customer base, and decades of experience enabling integrated, high-performance sensing and power solutions at scale. Its goal is to enable energy-efficient motion control across automotive and industrial markets by expanding its semiconductor offerings and providing strong engineering support.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Manchester, NH
Founded
1990

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