Principal Engineer - NAND Advanced Thin Films Process Development
No salary listed
Senior
PhD
Singapore
In Person
Manufacturing & Process EngineeringProcess Engineering
About the job
Requirements
- A PhD or equivalent degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field.
- Five to ten years of experience in thin-film research and development for NAND processes, specifically including chemical vapor deposition and diffusion thin films.
- Demonstrated mastery of thin-film deposition processes, including atomic layer deposition and chemical vapor deposition, encompassing process design, optimization, and integration for high-density NAND applications.
- In-depth knowledge of process-device and mechanical interactions, challenges associated with technology and device scaling, and reliability engineering principles for next-generation memory nodes.
- A proven track record of developing and implementing novel chemistries, materials, and hardware solutions, such as chamber design, plasma source optimization, and gas delivery systems.
- Expertise in advanced characterization techniques, including X-ray reflectivity, ellipsometry, scanning electron microscopy, transmission electron microscopy, secondary ion mass spectrometry, and X-ray photoelectron spectroscopy, as well as electrical evaluation methods including leakage, impedance, capacitance, and breakdown analysis.
- A strong foundation in thin-film process development using plasma and thermal methods, especially for dielectric films including low-k and high-k films and carbon-based films, with the ability to analyze structural-process correlations and conduct failure analysis.
- Experience in benchmarking technology, conducting competitive analyses, and assessing industry trends, with the capability to translate complex data into actionable technology roadmaps and process improvements.
- Ability to lead cross-disciplinary teams developing and deploying new process technologies, collaborating with integration, device, reliability, and manufacturing engineering groups.
- Proficiency in statistical process control, design of experiments, and data analytics for process optimization and troubleshooting.
- Experience with regulatory compliance, intellectual property management, and technical documentation in a semiconductor manufacturing environment.
Responsibilities
- Define and implement technical strategy for structural and electrical film process development, aligning it with business and technology objectives.
- Lead multifunctional teams in developing, integrating, and scaling thin-film processes tailored to advanced NAND structures and devices.
- Oversee end-to-end development of process modules, focusing on manufacturability, scalability, and integration readiness.
- Resolve complex technical challenges with significant business implications, including root cause analysis and mitigation of process or device failures.
- Mentor senior engineers and influence organizational technical direction.
- Represent the function in technical forums and participate in strategic collaborations, including industry consortia, technical conferences, and joint development projects.
- Deliver solutions that maintain competitive leadership in advanced memory technology, including benchmarking against industry standards.
- Drive technology transfer and ramp-up activities to transition processes from research and development to high-volume manufacturing.
- Identify and evaluate emerging trends, risks, and opportunities in structural and electrical film technology, and recommend future investments and critical initiatives.
- Lead cost reduction, yield improvement, and reliability enhancement programs through innovative process and material utilization.
About the company
Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.
Company Size
10,001+
Company Stage
IPO
Headquarters
Boise, Idaho
Founded
1978
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Simplify's Take
What believers are saying
- Demand is surging: in September 2026, Micron reported fiscal 2026 revenue of $133.19 billion, up from $37.38 billion.
- Boise is hiring: in August 2026, Micron planned about 3,500 direct jobs at two Idaho fabs opening from 2027.
- Sales are locked in early: by October 2026, most of Micron's 2027 HBM supply was contracted at higher prices.
What critics are saying
- Revenue is concentrated: about half of Micron's sales came from its top ten customers in each of three years.
- Departing engineers face scrutiny: in September 2026, Micron sued rival YMTC for hiring away at least 20 engineers.
- Boise is feeling the strain: an August 2026 report found the $50 billion Idaho buildout straining local infrastructure.
What makes Micron Technology unique
- AI memory is a three-player club: only Micron, SK hynix and Samsung make HBM, the stacked memory inside AI servers.
- It owns its factories: Micron makes chips in Taiwan, Singapore, Japan, the U.S., Malaysia, China and India.
- Data centers drive the business: its two data center units made $34.28 billion of quarterly revenue reported September 2026.
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Benefits
- Health Insurance
- Dental Insurance
- Vision Insurance
- Disability Insurance
- Parental Leave
- Unlimited Paid Time Off
- Paid Holidays
- Flexible Work Hours