Simplify Logo
Micron Technology

Micron Technology

Memory and storage semiconductor manufacturer

Manager Systems Design and Architecture

Full-Time
No salary listed
Expert
Bachelor's, Master's, PhD
Richardson, TX, USA
In Person

About the job

Requirements
  • A bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, with 10 or more years of experience in systems architecture, hardware development, storage, memory, or artificial intelligence infrastructure.
  • Proven experience leading and running senior technical teams and complex engineering programs, preferably in a pathfinding or advanced research and development organization.
  • Deep understanding of memory hierarchies, storage systems, and system-level performance analysis, including technologies such as High Bandwidth Memory, Double Data Rate/Low-Power Double Data Rate, solid-state drives, and NAND.
  • Working knowledge of artificial intelligence compute and storage system architectures, including interactions among xPU memory and storage hierarchies, graphics processing units, central processing units, data processing units, and accelerators.
  • Strong written and verbal communication skills, including executive-level technical presentations, and the ability to work effectively amid significant ambiguity and constantly evolving priorities.
Responsibilities
  • Lead system-level architecture assessment, prototyping, and exploration for advanced memory and storage technologies, including Compute Express Link, Double Data Rate/Low-Power Double Data Rate, High Bandwidth Memory, Non-Volatile Memory Express, emerging and disaggregated memory, field-programmable gate array-based controller emulation, and artificial intelligence infrastructure prototypes.
  • Establish requirements, success criteria, and experimental methods for evaluating performance, cost, power, and scalability tradeoffs.
  • Conduct architecture impact analysis in response to competitive threats.
  • Partner with Software and Applications Modeling teams to connect architectural concepts to real artificial intelligence workloads, leverage artificial intelligence, and foster cross-team collaboration within Storage and Memory Systems and across Technology and Products Group product groups.
  • Own technical execution for multi-year internal and externally funded programs, including achievements, deliverables, and reviews.
  • Lead system procurement, integration, lab bring-up, validation, and operational readiness.
  • Engage with internal and external partners, vendors, research organizations, and official bodies governing industry standards.
  • Support executive-level briefings, roadmap discussions, and team strategy sessions.
  • Manage, mentor, and develop a team of senior engineers across hardware, systems architecture, register-transfer-level/field-programmable gate array, board design, and system validation.
  • Strategically grow team capabilities in artificial intelligence system architecture, memory and input/output protocols, performance, power, and total-cost-of-ownership modeling, and advanced packaging and interconnect system impact.
  • Own resource planning, staffing allocation, budgets, and purchase approvals.
  • Ensure lab safety, compliance, and operational continuity.
Desired Qualifications
  • Experience with field-programmable gate array-based prototyping, hardware emulation, register-transfer-level verification flows, board-level development, electrical debugging, and lab bring-up.
  • Experience with system-level performance modeling, including bandwidth, latency, queueing, utilization, and trace-based analysis; power, energy, and total-cost-of-ownership modeling; and advanced packaging and interconnect technology evaluation.
  • Experience with government-funded research programs or national laboratories and active participation in industry standards bodies such as JEDEC, UCIe, Storage Networking Industry Association, Non-Volatile Memory Express, and PCI-SIG, with a proven track record of bridging research, engineering, and product strategy.
  • Experience integrating artificial intelligence tools into engineering workflows to improve team efficiency.

About the company

Micron Technology designs and manufactures memory and storage products, including DRAM, NAND, and NOR flash. These products power devices across computing, networking, automotive, industrial, and mobile markets. The company sells to OEMs, distributors, and end users worldwide and funds ongoing research and development to meet evolving needs. Micron aims to provide scalable memory solutions and maintain an inclusive, growth‑oriented workplace for its employees.

Company Size

10,001+

Company Stage

IPO

Headquarters

Boise, Idaho

Founded

1978

Get referred to Micron Technology

See people who can refer or advise you

Simplify Jobs

Simplify's Take

What believers are saying

  • Fiscal Q3 2026 revenue hit $41.46 billion; Q4 guidance targets $50 billion.
  • Micron's August 2026 Boise fab buildout and research lab deepen U.S. capacity.
  • Micron reported about $100 billion in remaining performance obligations across fourteen agreements in September 2026.

What critics are saying

  • Taiwan unions threatened strike September 2026, targeting Micron's largest manufacturing base and supply chain.
  • Micron's HBM share fell to 18% in Q2 2026, behind SK Hynix's 24.9%.
  • A 2027 HBM price reset after current contracts expire would crush margins and valuation.

What makes Micron Technology unique

  • Micron remains the only U.S.-based memory manufacturer, unlike Samsung and SK Hynix.
  • HBM4 shipments topped $1 billion by June 2026, ahead of HBM4E in 2027.
  • Micron Research Labs in Boise launched August 2026 with a $10 billion decade plan.

Help us improve and share your feedback! Did you find this helpful?

Benefits

Health Insurance

Dental Insurance

Vision Insurance

Disability Insurance

Parental Leave

Unlimited Paid Time Off

Paid Holidays

Flexible Work Hours

Growth & Insights and Company News

Headcount

6 month growth

4%

1 year growth

4%

2 year growth

4%
Yahoo Finance
Sep 15th, 2026
Micron appoints Deirdre Hanford as VP to lead memory and AI research labs

Micron Technology has appointed Deirdre Hanford as corporate vice president and president of Micron Research Labs, focusing on long-horizon memory and AI research. The stock has experienced recent volatility, falling 7.3% over the past week and 11.1% over 90 days amid AI-related headlines and sector pullbacks. However, shares remain up 194.1% year-to-date. Valuation estimates vary widely. One narrative suggests the stock is 54% undervalued with a fair value of $2,018.05 per share, based on projected margins exceeding 70% during tight market cycles. However, an alternative DCF model values shares at $574.63, below the current trading price of $927.60. Risks include capital-intensive fabrication requirements and exposure to trade tensions with China.

Yahoo Finance
Sep 15th, 2026
Micron appoints Deirdre Hanford to lead $10B research labs

Micron Technology has appointed Deirdre Hanford as corporate vice president and president of Micron Research Labs, the company's long-horizon research institution announced in August 2026. Hanford will establish the lab's research infrastructure, operating model and partnerships whilst defining a research agenda spanning Micron, academia, government, startups and the broader industry ecosystem. Micron Research Labs is headquartered in Boise, Idaho, and backed by Micron's planned $10 billion investment over the next decade. The facility is the first dedicated memory research hub of its kind in the US. Hanford brings extensive semiconductor industry experience, having spent 37 years at Synopsys in various leadership roles. She most recently advised organisations across semiconductors, electronic design automation, national defence and AI.

Yahoo Finance
Sep 15th, 2026
Micron demonstrates world's first 512GB DDR5 memory module for next-gen servers

Micron Technology has demonstrated the world's first 512GB DDR5 module for servers, marking a significant advancement in memory innovation. The module delivers speeds up to 9,200 MT/s whilst reducing operating power by more than 60 percent. The high capacity is achieved through Micron's advanced vertical interconnect packaging, which stacks DRAM dies using through-silicon vias. This enables up to 12TB of DDR5 DRAM in a single 24-slot dual-socket server. AMD and Intel are both validating the module for next-generation server platforms. The technology supports demanding AI, analytics, in-memory database, and simulation workloads with greater efficiency. The 512GB RDIMM allows multi-terabyte servers whilst maintaining existing server footprints, supporting larger workloads and improved virtualisation density.

Yahoo Finance
Sep 12th, 2026
Broadcom vs Micron: AI chip rivalry sees custom accelerators trump memory in 2026

Broadcom and Micron Technology are both capitalising on AI-driven demand, but offer different investment profiles. Broadcom provides diverse semiconductor and software solutions, whilst Micron specialises in memory and storage technologies. Broadcom reported fiscal 2025 revenue of $63.9 billion, up 23.9% year-over-year, with net income of $23.1 billion. The company has secured major agreements including a $200 billion memorandum of understanding with Samsung and a $30 billion chip commitment from Apple. Micron achieved fiscal 2025 revenue of $37.4 billion, a 48.9% increase, with net income of $8.5 billion. The memory specialist focuses heavily on data centres, which account for approximately 50% of total revenue. Both companies face customer concentration risks. Broadcom's top five customers represent around 40% of net revenue, whilst Micron derives over half its revenue from its top ten clients. Analysts favour Broadcom for its diversified portfolio and custom AI accelerator business, despite Micron's lower valuation metrics.

Yahoo Finance
Sep 12th, 2026
Micron shares drop 4.2% despite HBM shortage giving pricing power

Micron Technology fell 4.2% to $984.62 on Thursday despite a global high-bandwidth memory shortage giving suppliers increased pricing power. Chinese AI chip companies have raised prices due to scarce HBM supplies, with Huawei's upcoming Ascend accelerator reportedly becoming 20% to 50% more expensive. The American memory chip producer reported fiscal third-quarter revenue of $41.46 billion, up from $9.30 billion a year earlier. Adjusted free cash flow reached $18.3 billion, representing 44.1% of sales. Management expects approximately $50 billion in fourth-quarter revenue with an adjusted gross margin near 86%, implying a 20.6% sequential revenue increase. However, Micron's share price stands 56.92% above its GF Value estimate of $627.48, suggesting limited room for any cooling in AI demand or memory pricing.