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Micron Technology

Makes memory and storage chips for AI and PCs

Package Development Engineering Intern

Manufacturing EngineeringPosted on Nov 5
InternshipSingaporeNo salary listedIn-person

About the Job

Requirements

  • Strong analytical and problem-solving skills.
  • Comfort working with engineering data.
  • Familiarity with Excel, Python, Power BI, or similar analytical tools.
  • Interest in semiconductor technology, advanced packaging, manufacturing, artificial intelligence, or data analytics.
  • Currently pursuing a Bachelor's or Master's degree in Electrical or Electronic Engineering, Mechanical Engineering, Materials Science or Materials Engineering, Chemical Engineering, Data Science or Data Analytics, Computer Engineering, Computer Science, Manufacturing or Industrial Engineering, or another related technical or engineering discipline.

Responsibilities

  • Collect, analyze, and document engineering data related to package and process development.
  • Analyze engineering data to identify trends, issues, and improvement opportunities.
  • Conduct experiments, evaluations, package or process characterization, and development activities.
  • Contribute to yield, quality, cost, and cycle-time improvement.
  • Develop dashboards, automation, or analytical tools to improve engineering productivity and decision-making.
  • Apply artificial intelligence, data analytics, and automation to engineering workflows.
  • Collaborate cross-functionally with engineering teams to solve package development challenges.
  • Complete a focused engineering project with measurable outcomes.
  • Develop relevant engineering analysis, a model, dashboard, automation, or technical recommendation.
  • Document key findings, methodology, and recommendations; prepare a concise technical summary.
  • Present the final project, results, and learnings to the Package Development Engineering team or leadership.

Desired Qualifications

  • Experience working with real engineering problems, datasets, and development activities.
  • Exposure to advanced packaging, yield improvement, engineering analytics, automation, or artificial-intelligence-enabled engineering.
  • Experience taking a project through problem definition, analysis, solution, and recommendation.
  • Exposure to technical communication and presenting engineering findings to leadership.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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