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Hewlett Packard Enterprise

Builds servers, networking and private cloud

Mechanical/Hardware Engineer - Thermal

Thermal & Fluids EngineeringConfirmed live in the last 24 hours
Full-timeChippewa Falls, WI, USA

About the Job

Requirements

  • A bachelor's or master's degree in Mechanical Engineering is required.
  • Typically 2–4 years of experience is required.
  • Experience using ProEngineer or other 3D computer-aided design software as a mechanical design tool.
  • Ability to apply analytical and problem-solving skills.
  • Experience designing sheet metal and plastic parts, including associated production tooling and processes.
  • Experience using computational fluid dynamics and thermal mockups to validate thermal solutions.
  • Strong written and verbal communication skills, with mastery of English and the local language.
  • Ability to communicate design proposals effectively and negotiate options.
  • Strong understanding of and experience in electronics packaging.
  • Proficiency with computational fluid dynamics and thermal mockups to validate thermal solutions.
  • Ability to learn risk management skills, including understanding and assessing risk qualitatively and using techniques to measure subcontractor and vendor performance.

Responsibilities

  • Lead multiple project teams of mechanical hardware engineers and internal and outsourced development partners through all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling, and testing.
  • Manage and expand relationships with internal and outsourced development partners on mechanical and thermal design and development.
  • Review and evaluate designs and project activities for compliance with technology and development guidelines and standards, and provide tangible feedback to improve product quality.
  • Provide domain-specific expertise and mechanical and thermal leadership to cross-organization projects, programs, and activities.
  • Drive innovation and integrate new technologies into projects and activities in the mechanical and thermal design organization.
  • Provide guidance and mentoring to less-experienced staff members.
  • Develop cost-effective cooling solutions that perform effectively in thermal and acoustic terms.
  • Perform system-level thermal design focusing on fan and heatsink technology, materials science, chemistry, fluid flow, and system-level control logic.
  • Develop initial concepts and mechanical designs, oversee thermal simulation using Flotherm or other software, create mockups using dummy heat loads, and validate solutions.
  • Interface with vendors on technical issues.
  • Travel internationally as needed.

About the Company

Hewlett Packard Enterprise

Builds servers, networking and private cloud

Hewlett Packard Enterprise sells servers, storage, networking and hybrid cloud software to large companies, governments and service providers. Its GreenLake platform lets customers run on-premises hardware as a metered cloud service, and its Cray supercomputers run national lab and AI training workloads. The networking business, built on Aruba and Juniper Networks, supplies campus, data-center and routing equipment. Revenue comes from hardware sales, multiyear support contracts, financing and subscriptions. The company traces its roots to Hewlett-Packard, founded in 1939, became a separate public company in 2015 and is headquartered in Houston, Texas.

Company size
10,001+
Company stage
IPO
Headquarters
Houston, TX
Founded
1939

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