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Micron Technology

Makes memory and storage chips for AI and PCs

HBM SoC Design Engineer/Architect New Grad

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeIn-person

About the Job

Requirements

  • A Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, completed before the employment start date.
  • Academic, research, internship, or project experience in digital design, ASIC development, FPGA design, computer architecture, or a related discipline.
  • Working knowledge of Verilog, SystemVerilog, VHDL, or another hardware description language.
  • Understanding of digital design fundamentals, including finite-state machines, pipelining, clocking, reset strategies, timing concepts, and synchronous logic.
  • Strong analytical, problem-solving, written communication, and verbal communication skills, with the ability to work effectively in collaborative engineering environments.

Responsibilities

  • Design, implement, and integrate digital logic and subsystem RTL using Verilog or SystemVerilog for next-generation HBM SoC solutions.
  • Collaborate with architects and multifunctional engineering teams to translate functional requirements into microarchitectures, interface definitions, and implementation plans.
  • Support design-quality activities, including simulation, synthesis, static timing analysis, clock-domain crossing analysis, debugging, and design reviews.
  • Evaluate power, performance, area, and timing tradeoffs to develop data-driven technical recommendations and improve design quality.
  • Develop automation solutions and leverage AI-assisted workflows, generative AI, large language models, or agentic AI technologies to improve engineering productivity, verification efficiency, and design analysis.

Desired Qualifications

  • A Master's or Ph.D. degree in Electrical Engineering, Computer Engineering, or a related technical discipline, completed before the employment start date.
  • Coursework, research, internship, or project experience in SoC design, RTL development, design verification, physical design, embedded systems, or semiconductor technologies.
  • Familiarity with synthesis, static timing analysis, simulation, formal verification, UVM, FPGA prototyping, or industry-standard EDA tools.
  • Understanding of memory systems and high-speed interfaces such as HBM, DDR, LPDDR, PCIe, or CXL.
  • Experience with automation, AI-enabled development tools, generative AI, large language models, AI assistants, or agentic AI solutions applied to semiconductor design, validation, or engineering workflows.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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