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Micron Technology

Makes memory and storage chips for AI and PCs

Front End Central Product Integration Engineer – Senior / Staff / Principal - Test & Product Yield Integration

Process EngineeringConfirmed live in the last 24 hours
Full-timeNo salary listed

About the Job

Responsibilities

  • Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products.
  • Centralize and synthesize project information, including design requirements, test challenges, and yield learning, from multiple global teams, and drive execution to closure.
  • Drive yield breakthroughs by understanding the end-to-end test flow, product design and operation, packaging interactions, and manufacturing processes while balancing yield and reliability requirements.
  • Characterize device failure modes using knowledge of device architecture, physics, packaging interaction, and available test and process knobs to foster technical innovation.
  • Define and drive strategies to ensure Packaging Technology and Chip-Package Interaction are developed and qualified ahead of product qualification.
  • Lead cross-functional and cross-site taskforces across Product, Test, Yield, Design, Fab, Packaging, Quality, and TD to resolve yield and quality challenges in a timely manner.
  • Promote network Best-Known-Method development, standardization, and business process creation or re-engineering to improve productivity and efficiency.
  • Maintain working relationships with stakeholders in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams.
  • Communicate project status, risks, and proposals through written reports and technical presentations.
  • Identify obstacles, escalate when needed, and partner with management to drive successful outcomes.
  • Travel to Micron fab and development sites as needed to support project execution and alignment.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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