Fall 2026
Digital Verification Engineer Intern
NXP Semiconductors
10,001+ employees
Automotive semiconductors and secure embedded solutions
No salary listed
Kanata, Ottawa, ON, Canada
In Person
Bachelor's, Master's
 QA & Testing (1) |
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- Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Electronics, Computer Engineering, Computer Science, Physics, or a related discipline.
- Hands-on experience from lab work, design projects, internships, coursework, or student competitions is a plus.
- Familiarity with role-related engineering, design, verification, programming, or lab tools, with willingness to learn quickly.
- A strong foundation in engineering fundamentals, problem solving, testing, and technical documentation.
- Ability to collaborate with cross-functional teams and communicate technical ideas clearly.
- Good written and spoken communication skills in English.
- Contribute to verification activities by developing test scenarios, running simulations, and analyzing results under guidance from the team.
- Assist with debugging design issues, maintaining test environments, and improving verification coverage.
- Work with design and methodology teams to clarify requirements and support issue resolution.
- Help prepare reports and documentation that summarize findings, status, and next steps.
- Contribute to design quality, technical learning, and continuous improvement of verification practices.
NXP Semiconductors designs and sells semiconductor chips for vehicles and other devices. Its products include automotive-grade microcontrollers and other ICs used in engines, infotainment, safety systems, and networked car architectures. These chips process data, run software, and enable features such as advanced driver assistance and vehicle connectivity, often with strong security and real-time performance. Unlike some peers, NXP became an independent company after Philips spun off its semiconductor unit in 2006 and later merged with Freescale in 2015, building a focused strength in automotive semiconductors and microcontrollers. This gives it a clear niche in the market and the goal of growing as a standalone leader in smarter, connected vehicles and related technologies.
Company Size
10,001+
Company Stage
IPO
Headquarters
Eindhoven, Netherlands
Founded
2004
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Simplify's Take
What believers are saying
- NXP raised Q3 2026 revenue guidance to $3.75 billion after Q2 strength.
- The August 12, 2026 Malaysia expansion doubles assembly and test output by 2028.
- SAF9800 and BMW UWB wins expand content per vehicle across infotainment and safety.
What critics are saying
- UBS cut NXP on August 3, 2026, citing China automotive inventory correction.
- Automotive drives 55% of revenue; a China slowdown hits NXP first and hardest.
- Ambarella talks on July 31, 2026 signal acquisition risk, distraction, and integration overpayment.
What makes NXP Semiconductors unique
- NXP dominates automotive semis, especially secure access, radar, and software-defined vehicle platforms.
- BMW selected NXP Trimension UWB for 2026 models, proving differentiated automotive design wins.
- NXP’s hybrid manufacturing network in Malaysia, Singapore, and Dresden strengthens supply resilience.
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Growth & Insights and Company News
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↑ 0%NXP Semiconductors has broken ground on an assembly and test facility expansion in Petaling Jaya, Malaysia. The new factory will add approximately 500,000 square feet of production space to NXP's existing site, bringing total production space to around 900,000 square feet. The facility is expected to begin production in the first quarter of 2028. Once fully operational, the site's output is projected to more than double. The expansion will increase NXP's internal assembly and test capacity and support future growth across its manufacturing ecosystem, including joint ventures in Singapore and Dresden, Germany. The facility will function as a smart factory, featuring automated material handling systems and advanced quality management technologies. The groundbreaking ceremony included government officials and NXP executives, with Malaysia's Minister of Digital and the Dutch Ambassador to Malaysia in attendance.
Nasdaq-listed NXP Semiconductors expands Malaysia assembly, test capacity with new plant. 12 Aug 2026, 09:01 pm NXP executive vice-president and chief operations and manufacturing officer Andy Micallef (fourth from left), Deputy Investment, Trade and Industry Minister Sim Tze Tzin (fifth from left), Digital Minister Gobind Singh Deo (sixth from left), Netherlands ambassador to Malaysia Jacques Werner (seventh from left) and other representatives at the groundbreaking ceremony on Wednesday. (Photos by Zahid Izzani/The Edge) KUALA LUMPUR (Aug 12): Nasdaq-listed NXP Semiconductors NV is expanding its assembly and test operations in Malaysia with a new highly automated facility that will more than double its production capacity in the country when fully operational. The new facility, known as the North Campus, will be operated by its local unit NXP Malaysia and is expected to be completed by the first quarter of 2028, with commercial operations to begin thereafter. The facility will add about 500,000 sq ft of production space, bringing NXP Malaysia's total production space to about 900,000 sq ft. "This expansion increases our assembly and test capacity while diversifying operations to strengthen supply chain resilience and flexibility for customers worldwide," NXP executive vice-president and chief operations and manufacturing officer Andy Micallef said at the groundbreaking ceremony on Wednesday. Micallef, however, did not disclose NXP Malaysia's current production output or capacity. Gobind said the investment would support greater adoption of artificial intelligence and Malaysia's target of increasing the digital economy's contribution to gross domestic product to 30% by 2030. Micallef did not disclose NXP Malaysia's current production output or capacity. The North Campus will be located less than 500 metres from NXP Malaysia's existing South Campus in the Sungai Way Free Trade Zone in Selangor. The new facility will feature automated material handling systems and advanced quality management technologies aimed at improving operational efficiency and supporting high-quality production. NXP Malaysia operates a semiconductor manufacturing facility in Petaling Jaya dedicated to the assembly and testing of integrated circuits. Assembly and testing form part of the back-end semiconductor manufacturing process, where devices are packaged and tested before being supplied for use in electronic systems. Netherlands ambassador to Malaysia Jacques Werner The groundbreaking ceremony was officiated by Digital Minister Gobind Singh Deo, Deputy Investment, Trade and Industry Minister Sim Tze Tzin, Selangor State Investment, Trade and Mobility exco Ng Sze Han, Netherlands ambassador to Malaysia Jacques Werner, and NXP Malaysia managing director and vice-president Goon Ben Nee. Gobind said the investment would support greater adoption of artificial intelligence and Malaysia's target of increasing the digital economy's contribution to gross domestic product to 30% by 2030. "NXP's expansion contributes not only to Malaysia's manufacturing base, but also to the technological foundation of our digital economy," he said. "We want investments that introduce more advanced systems into our industrial base, create higher-value technical roles and give Malaysians the opportunity to work with technologies that will define the future of manufacturing," Gobind added. Edited By Emir Zainul
NXP Semiconductors breaks ground on assembly and test site expansion in Malaysia. August 12, 2026 09:00 ET | Source: NXP USA, Inc. * New Petaling Jaya facility will increase internal A&T capacity, further diversify NXP's back-end manufacturing capabilities and strengthen its global supply chain * Leveraging advanced automation technologies, the smart factory is expected to ramp production in the first quarter of 2028 and more than double the site's output at full capacity * The expanded operations reinforce NXP's hybrid manufacturing strategy, which provides supply control and geographic resilience PETALING JAYA, Malaysia, Aug. 12, 2026 (GLOBE NEWSWIRE) - NXP Semiconductors N.V. (NASDAQ: NXPI) today celebrated the groundbreaking of its new assembly and test (A&T) factory in Petaling Jaya, Malaysia, an expansion of the company's existing A&T site. The facility will further strengthen NXP's global manufacturing footprint and increase internal capacity to support greater supply chain resilience and flexibility. The groundbreaking ceremony brought together government officials, partners and NXP executives and team members to commemorate the start of construction. NXP was also honored to have the Honorable Gobind Singh Deo, Minister of Digital, Malaysia and His Excellency Jacques Werner, Ambassador of the Kingdom of the Netherlands to Malaysia, speak at the ceremony. Adding approximately 500,000 square feet of production space, the facility will expand NXP's current operations in Malaysia, which is dedicated to supporting the assembly and testing of NXP's broad product portfolio. Upon completion of the new factory, the total site will encompass around 900,000 square feet of production space. The factory is expected to begin ramping production in the first quarter of 2028, with the site's overall output projected to more than double once fully operational. The added A&T capacity will help support future growth across NXP's manufacturing ecosystem, including expected output from the VSMC joint venture in Singapore and the ESMC joint venture in Dresden, Germany. "Malaysia has been an important part of NXP's global manufacturing footprint for decades, with a strong semiconductor ecosystem and skilled talent base," said Andy Micallef, Executive Vice President and Chief Operations and Manufacturing Officer. "This expansion builds on that foundation, increasing our assembly and test capacity while diversifying operations to strengthen supply chain resilience and flexibility for customers worldwide." Designed as a highly automated smart factory, the facility will feature Automated Material Handling Systems (AMHS) and advanced quality management technologies to optimize manufacturing operations, improve efficiency and support high-quality production. The expansion of internal A&T operations is a key part of NXP's hybrid manufacturing strategy, which is designed to provide greater flexibility, supply control and geographic diversification. The expanded Petaling Jaya site complements NXP's existing A&T operations, including those in Greater China and Thailand, to help maintain a balanced and globally diversified manufacturing network. Since its establishment in Malaysia in 1972, NXP has built a long-standing manufacturing presence in the country, which serves as a critical hub within NXP's global supply chain. In addition to expanding manufacturing capacity, NXP continues to invest in Malaysia's future engineering workforce through strategic collaborations with local universities, supporting engineering education and fostering research partnerships that help develop Malaysia's next generation of semiconductor talent. About NXP Semiconductors NXP Semiconductors N.V. (NASDAQ: NXPI) is the trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets. NXP's "Brighter Together" approach combines leading-edge technology with pioneering people to develop system solutions that make the connected world better, safer, and more secure. The company has operations in more than 30 countries and posted revenue of $12.27 billion in 2025. Find out more at www.nxp.com. | For more information, please contact: | / | | Americas & Europe | / | | Paige Iven | / | | Tel: +1 817-975-0602 | / | | Email: [email protected] | / | | NXP-Corp | / | | / | / |
Applied Materials has emerged as a standout in the semiconductor sector, according to recent analysis. The company, founded in 1967 as the first semiconductor equipment toolmaker, boasts a 29.1% operating margin and 46.2% return on invested capital. The semiconductor industry has surged 50.2% over six months, outpacing the S&P 500 by 39.1 percentage points. However, not all chip companies face equal prospects. NXP Semiconductors has experienced flat sales over two years, with projected growth of just 15.4% for the next 12 months. The company, spun off from Philips in 2006, trades at 13.9 times forward earnings with a market capitalisation of $60.45 billion. Universal Display has seen sales decline 1.3% annually over two years, with Wall Street forecasting modest 8.2% growth ahead.
Edge AI to drive next generation of autonomous vehicle safety and performance. Edge AI will play a central role in autonomous vehicles by enabling real-time safety decisions with low latency. NXP Semiconductors is developing distributed intelligence for automotive and industrial applications, focusing on safety and reliability. Aug 05, 2026 02:57 pm IST The future of autonomous vehicles will depend on edge AI, not just cloud computing, according to Hitesh Garg, head of NXP Semiconductors' engineering in India. Speaking at Siemens Realize LIVE APAC 2026, Garg said real-time intelligence is essential for vehicles to make safety-critical decisions within milliseconds. Key highlights. * Edge AI will enable real-time safety decisions in autonomous vehicles. * NXP applies distributed intelligence across automotive and industrial sectors. * Ultra-low latency and high trust are essential for edge AI systems. * Software-defined vehicle architectures support future AI-powered mobility. Edge AI enables instant decision-making. Garg explained that the main challenge for the industry is no longer building more powerful AI models. Instead, the focus is on deploying AI safely in the physical world. Vehicles, robots, and industrial machines must react instantly to changing conditions. He stated, "The next step is AI coming to the physical world." Garg compared future autonomous vehicles to the human nervous system. The brain handles reasoning, while the spinal cord manages reflexes. Similarly, future vehicle architectures will combine central AI computing with distributed edge processors. These processors will make immediate safety decisions and reduce reliance on cloud connectivity for time-critical functions. For drivers, this means that emergency braking, collision avoidance, steering corrections, and other advanced safety features will operate with ultra-low latency. These functions can continue even if cloud connectivity is unavailable or too slow. Key principles for Edge AI success. Garg outlined three principles for successful edge AI systems: ultra-low latency, low power consumption, and high trust levels. As vehicles become more software-defined, computing architectures must provide intelligence, functional safety, cybersecurity, and resilience against failures. He emphasized, "The real world has no undo button." Autonomous systems should be designed to recover safely when faults occur. Designers should not assume that failures can be completely eliminated. Applications across multiple industries. NXP is applying this architectural approach in several industries. These include automotive, robotics, drones, and industrial automation. Distributed intelligence allows systems to make local decisions while staying coordinated with central computing platforms. Automakers are adopting software-defined vehicle architectures. These consolidate multiple electronic control units into central and zonal computing platforms. This creates a foundation for AI-powered driving, over-the-air software updates, and future autonomous functions. Garg said this shift will make edge AI a key enabler for advanced driver assistance systems, autonomous driving, and the next generation of intelligent mobility.