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Micron Technology

Makes memory and storage chips for AI and PCs

Front End Central Product Integration Senior / Staff / Principal / Engineer - Test & Product Yield Integration

Process EngineeringConfirmed live in the last 24 hours
Full-timeHiroshima, JapanNo salary listed

About the Job

Requirements

  • A Bachelor's, Master's, or PhD degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science Engineering, or a related field.
  • At least 2 years of experience in Product Integration, Test Engineering, Yield Engineering, Design Engineering, BEOL semiconductor processing, or process integration.
  • Strong knowledge of semiconductor device physics and DRAM product operations.
  • Understanding of wafer fabrication process flows, parametric/electrical testing, and probe yield.
  • Strong data analysis, debugging, troubleshooting, and problem-solving skills with attention to detail.
  • Effective verbal and written communication skills, including presenting to small and large technical audiences.
  • Ability to collaborate across functions and cultures and build strong customer and coworker relationships.
  • Ability to work independently with minimal supervision, manage multiple priorities, and stay organized.
  • Intermediate to advanced PC skills, including Microsoft Office.
  • Willingness to travel approximately 20–50% to support global project needs.
  • Flexibility to adapt to changing priorities and take on additional responsibilities as needed.

Responsibilities

  • Provide technical leadership across the global network to drive yield, product quality, and New Product Introduction through technical expertise, business process development, and project execution.
  • Lead global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products.
  • Centralize and synthesize project information, including design requirements, test challenges, and yield learning, from multiple global teams and drive execution to closure.
  • Drive yield breakthroughs by understanding end-to-end test flow, product design and operation, packaging interactions, and manufacturing processes while balancing yield and reliability requirements.
  • Characterize device failure modes using knowledge of device architecture, physics, packaging interaction, and available test and process controls.
  • Define and drive strategies to ensure Packaging Technology and Chip-Package Interaction are developed and qualified ahead of product qualification.
  • Lead cross-functional and cross-site taskforces across Product, Test, Yield, Design, Fab, Packaging, Quality, and Technology Development to resolve yield and quality challenges in a timely manner.
  • Promote network Best-Known-Method development, standardization, and business process creation or re-engineering to improve productivity and efficiency.
  • Maintain working relationships with partners in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams.
  • Communicate project status, risks, and proposals through written reports and technical presentations.
  • Identify obstacles, escalate when needed, and partner with management to drive successful outcomes.
  • Travel to Micron fab and development sites as needed to support project execution and alignment.

Desired Qualifications

  • Experience in DRAM High Bandwidth Memory products.
  • Exposure to DRAM HPM, advanced packaging, chip-package interaction, BEOL integration, or layout-related topics.
  • Experience working across Test, Product, Yield, Design, Packaging, and Manufacturing organizations.
  • Ability to drive alignment and execution in central or network-level roles.
  • Curiosity about innovation, continuous improvement, and scalable solution development.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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