Manager Packaging Engineering - Substrate

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THE ROLE:

We are seeking a proactive team member for our External Manufacturing Operations Substrate team. This role is crucial in ensuring the stable supply of IC substrates for a leading CPU/GPU company. You will be responsible for driving key performance metrics related to NPI projects, HVM Sustaining,  supplier HVM readiness, process optimization, and improvements in areas like yield, BCP, and CIP.

THE PERSON:

The successful candidate will be a strong team player with a proactive attitude, problem-solving skills, and capable of meeting deadlines in a fast-paced, multitasking environment. You should have excellent communication, project management, and data analysis skills to effectively manage substrate suppliers. Proficiency in English (speaking, writing, and presenting) is essential.

KEY RESPONSIBILITIES:

• Plan, Drive and Manage substrate supplier and AMD internal stakeholders from NPI bring up/Qualification/ Ramp Up readiness to Production release and Sustaining.
• Substrate supplier’s new production site bring up & qualification.
• Drive & Oversee HVM yield attainment, sustaining-issue resolution and issue prevention and improvements through Data Analytics.
• Lead knowledge-sharing initiatives (Best Known Methods, lessons learned) and drive Continuous Improvement Projects (CIPs).
• Monitor & Drive supplier performance using scorecards and lead quarterly technical reviews to ensure improvements.
• Lead projects to drive cross supplier performance improvement/quality enhancement
• Drive for supplier engagement on continuous improvement and new capabilities ahead of need.
• Plan and execute change management from internal or external parties.
• Involve in regional supplier management.
• Assist in additional duties as deemed fit by supervisor.

PREFERRED EXPERIENCE:

• Experience in IC Substrate Operations or OSAT ( with Substrate experience) or with Fabless companies (Managing substrate suppliers).
• Technical expertise in FC-BGA, LGA substrate mfg, assembly and related Interactions.
• Experience in substrate development, from NPI to HVM, is a plus.
• Strong statistical knowledge (DOE, SPC, 6 Sigma) and expertise in data analysis and technical report writing. Familiar with tools (JMP, minitab, failure analysis knowledge, package reliability knowledge) and industry standard (ESD, JEDEC, Automotive).
• People management skills (added advantage).
• Good leadership and interpersonal relationship.
• Proven project management experience with technical understanding, and a track record of successfully applying project management knowledge to deliver complex projects.
• Good English speaking, Executive communication, and Presentation skills.

ACADEMIC CREDENTIALS:

Bachelor/MS degree in Mechanical/Material/Chemical or other Engineering background

LOCATION:

Hsinchu, Taiwan

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Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.  AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.