Senior Liquid Cooling Thermal Design & Validation Engineer

THE ROLE:

Join AMD’s Data Center Platform Engineering Group (DPEG), where you will help develop the next generation of liquid-cooled AI and high-performance computing platforms. As a Senior Liquid Cooling Thermal Design & Validation Engineer, you will be part of a highly collaborative thermal engineering team responsible for creating innovative cooling solutions that enable AMD’s industry-leading data center GPU products. In this role, you will work across the entire product development lifecycle, partnering with thermal engineers, mechanical engineers, silicon teams, system architects, manufacturing partners, and external vendors to develop and validate advanced thermal solutions. Your work will span from concept development and simulation to hands-on laboratory testing and prototype validation. You will have the opportunity to influence the design of cutting-edge AI hardware while working in a fast-paced environment that combines technical innovation, experimentation, and real-world product impact.

THE PERSON:

The ideal candidate is a self-starter who enjoys solving complex engineering challenges and thrives in a collaborative, fast-paced environment. They are naturally curious, enjoy hands-on technical work, and possess strong problem-solving and troubleshooting abilities.Successful candidates are comfortable working across multiple disciplines, communicating with technical and non-technical stakeholders, and driving projects forward with minimal oversight. They are motivated by learning new technologies, tackling challenging engineering problems, and contributing to innovative products that push the boundaries of AI and data center computing.

KEY RESPONSIBILITIES:

• Develop and validate liquid cooling solutions for AMD data center GPU and AI computing platforms.
• Drive thermal-mechanical solution development from concept through prototype validation and production readiness.
• Collaborate with internal engineering teams and external vendors to develop innovative cold plate, heat sink, and liquid cooling technologies.
• Perform thermal simulations and laboratory-based validation testing.
• Conduct flow, pressure drop, temperature mapping, and thermal performance measurements.
• Analyze test results, identify thermal bottlenecks, and recommend design improvements.
• Generate technical documentation and communicate findings to engineering stakeholders.
• Contribute to continuous improvement initiatives that enhance product quality, reliability, and time-to-market.
• Support the development and deployment of next-generation liquid-cooled server and rack-level cooling solutions.

PREFERRED EXPERIENCE:

• Thermal design and validation of high-power electronics, AI platforms, HPC systems, or data center server products.
• Development of liquid cooling technologies including cold plates, heat sinks, and rack-level cooling solutions.
• Experience working with vendors and suppliers on thermal-mechanical solution development.
• CFD analysis using Icepak, FloTHERM, Ansys Fluent, or similar tools.
• Strong understanding of heat transfer, fluid mechanics, electronics cooling, and thermal management principles.
• Flow network modeling, pressure drop analysis, and coolant optimization.
• Laboratory testing, instrumentation, telemetry systems, data acquisition, and thermal characterization.
• Mechanical design experience using Creo, SolidWorks, or similar CAD tools.
• Knowledge of GD&T, manufacturing tolerances, assembly processes, and design-for-manufacturing methodologies.
• Understanding of cold plate manufacturing technologies including machining, brazing, skiving, friction stir welding, or additive manufacturing.
• Experience with thermal and mechanical validation of liquid-cooled server platforms.
• Familiarity with FEA, statistical analysis, design optimization, and experimental methodologies.
• Experience with Python, MATLAB, LabVIEW, or similar tools for automation and data analysis.
• Familiarity with Open Compute Project (OCP) standards and modern AI infrastructure architectures.

ACADEMIC CREDENTIALS:

• Bachelor's or master’s degree preferred in Mechanical Engineering or a related engineering discipline.
• Master's degree preferred in Mechanical Engineering, Thermal Engineering, Heat Transfer, Fluid Mechanics, or a related field.
• Doctoral degree desired.
• Relevant certifications, research experience, or specialized training in thermal engineering, CFD, liquid cooling, or mechanical design are a plus.

LOCATION: Secaucus, New Jersey

This role is not eligible for visa sponsorship.

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