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Micron Technology

Makes memory and storage chips for AI and PCs

Process Development Engineer Intern - 3D DRAM Dry Etch

Process EngineeringConfirmed live in the last 24 hours
Internship · Fall 2026Boise, ID, USANo salary listedIn-person

About the Job

Requirements

  • Currently pursuing an M.S. or Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a related technical field.
  • Must be enrolled in an academic program throughout the internship period.
  • Knowledge of dry etch semiconductor processing, plasma physics, or related semiconductor fabrication technologies.
  • Experience with experimental design, data analysis, statistical methods, or engineering research projects.
  • Strong analytical, problem-solving, written, and verbal communication skills.

Responsibilities

  • Research and develop innovative solutions that support next-generation memory technologies and advanced dry etch processes.
  • Design, implement, and analyze experiments to improve etch process performance, manufacturability, and product quality.
  • Perform statistical analysis of technology development and pilot manufacturing data to identify trends, process opportunities, and root causes.
  • Collaborate with process, equipment, and integration engineering teams to resolve technical challenges and drive process improvements.
  • Apply AI-enabled analysis tools, data-driven methodologies, or programming solutions to improve engineering efficiency and accelerate technical decision-making.

Desired Qualifications

  • Experience with semiconductor process development, process characterization, or advanced manufacturing environments.
  • Experience with programming, scripting, data analytics, or leveraging artificial intelligence to support engineering analysis and workflow optimization.
  • Familiarity with statistical analysis software, data visualization tools, Python, MATLAB, JMP, or similar platforms.
  • Experience conducting root-cause analysis, failure analysis, or process optimization projects.
  • Demonstrated ability to work independently, manage multiple priorities, and collaborate effectively within multi-functional teams.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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