Foxconn Industrial Internet

Designs and manufactures intelligent manufacturing solutions

Director of Technical Leader for Advanced PCBA and System Integration

Manufacturing EngineeringConfirmed live in the last 24 hours

Full-timeVietnamNo salary listedIn-person

About the Job

Requirements

A bachelor's or master's degree in Engineering, Material Science, Statistics, or a related field is required.
At least 10 years of manufacturing engineering and process or technology development experience for PCBA and system integration is required.
At least 5 years of experience in electronic manufacturing within a contract manufacturer environment, with a proven record, is required.
Knowledge and experience with PCBA using large-size BGA greater than 80 mm x 80 mm, Co-Packaged Optics, Thermal Compression Bonding, high-speed connectors or flying cables, and liquid cooling are preferred.
Strong English communication skills in listening, speaking, reading, and writing are required.
The ability to lead projects from beginning to end and drive initiatives with a global team is required.
The ability to work under pressure is required.
The role is based in Vietnam.

Responsibilities

Lead the development of advanced PCBA and system integration manufacturing capabilities at Vietnam sites.
Collaborate with customer technical teams and Foxconn Research and Development to co-develop test vehicles, technical specifications and checklists, reliability testing, design for manufacturability, and processes for new assembly and rework technology, component packaging, and process materials.
Build strong collaborative relationships with clients and internal cross-functional teams.
Lead the manufacturing technical team and coordinate with laboratories in Vietnam and globally to regularly perform process and reliability evaluations.
Support Foxconn central teams and other sites and business units in sharing and developing new advanced manufacturing capabilities.
Develop and mentor leaders to strengthen their people skills and grow as well-rounded, high-potential technical professionals.

Desired Qualifications

Knowledge and experience with PCBA using large-size BGA greater than 80 mm x 80 mm, Co-Packaged Optics, Thermal Compression Bonding, high-speed connectors or flying cables, and liquid cooling.

Responsibilities:
• Lead the Development of Advanced PCBA / SI Mfg capabilities in the Vietnam sites
• Collaborate and interact with customer technical team and Foxconn R&D to co-develop Test
Vehicle, Technical Spec/Checklist, Reliability Testing, DFM and Process for new assembly, rework
technology, component packaging and / or process material. Fostering strong and collaborative
relationships with clients and internal cross functional teams.
• Lead the Mfg technical team and work the labs at Vietnam and global labs to perform all the process
and reliability evaluation regularly. .
• Support Foxconn central and other sites and BUs to share and develop new Advanced Mfg
Capabilities .
• Develop and mentor leaders to have good people skill and as well-rounded, high-potential technical
professionals.
Requirements:
1. Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields.
2. Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for
PCBA and SI and minimum 5 years in management position.
3. At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM)
environment with a proven record.
4. Knowledge and experience of PCBA with large size BGA (> 80 mm x 80 mm), Co-Packaged
Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are
preferable,
5. Strong English communication skills (listening, speaking, reading, and writing) and excellent
interpersonal skill
6. Ability to lead projects from beginning to end and drive initiatives with a global team.
7. Ability to work under pressure.
8. Work location is in Vietnam

About the Company

Foxconn Industrial Internet

Designs and manufactures intelligent manufacturing solutions

Foxconn Industrial Internet designs and manufactures technology infrastructure for large tech firms, focusing on intelligent manufacturing and the industrial internet. It combines hardware design and production with software-enabled solutions, including AI and automation platforms like Lighthouse Factory, the FII Cloud (with Tencent Cloud), and Fog Cerebellum, to help clients digitize data and optimize production lines. It differentiates itself through large-scale integration as a design-to-manufacture partner, exclusive assembly of premium Nvidia GB200 AI servers, and a strong push into higher-margin cloud, networking, and industrial AI services backed by Foxconn. Its goal is to move from traditional contract manufacturing to high-value technology services, expanding its AI-server, data-center, EV, and semiconductor test automation businesses with scalable intelligent manufacturing solutions.

Company size: 1,001-5,000
Company stage: IPO
Headquarters: Shenzhen, China
Founded: 2015

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