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Black Semiconductor

Graphene photonics enable optical chip interconnects

Finance Working Student Intern - Fördermittelmanagement

AccountingConfirmed live in the last 24 hours
InternshipAachen, GermanyNo salary listedHybrid

About the Job

Requirements

  • The candidate must be studying economics/business studies or a comparable degree program and have a good aptitude for numbers.
  • The candidate should work carefully and reliably, be well organized, and enjoy communicating.
  • The candidate must have good German and English skills and be proficient with Microsoft Office, especially Excel.
  • The candidate should be comfortable with IT and interested in digitalization, automation, and artificial intelligence.

Responsibilities

  • Support the finance team on publicly funded research projects, including reporting, data preparation, and process optimization.
  • Contribute to reporting for publicly funded projects.
  • Analyze and check financial and time data and support the preparation of financial documentation.
  • Help shape digital and AI-supported processes to automate and optimize finance workflows.
  • Contribute to the introduction of a new ERP system and the development of data and reporting structures.

Desired Qualifications

  • Knowledge of SAP is a plus.

About the Company

Black Semiconductor

Graphene photonics enable optical chip interconnects

Black Semiconductor develops graphene-based photonics that integrate optical components into the outer layers of CMOS-like chips, enabling direct optical chip-to-chip communication. It works by using graphene as a translator to convert electronic signals to optical signals and back, so electrons on silicon can talk to photons through integrated photonic interconnects. This approach differs from traditional silicon photonics or pure electronic interconnects by being CMOS-compatible, wafer-scale, and capable of linking multiple chips as a single high-performance unit while reducing production steps by about 60%. The company aims to move from pilot production to mass manufacturing, building a 300mm wafer facility (FabONE) in Aachen, with pilot production by 2027 and mass production by 2031, backed by a large European funding round and investors.

Company size
51-200
Company stage
Series A
Total funding
$287.4M
Headquarters
Aachen, Germany
Founded
2020

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