Field Application Engineer

• 为客户技术团队提供现场应用支持，与客户直接接口人建立稳固的合作关系Provide on-site application support to customers' technical teams and establish strong working relationships with key customer contacts.

• 与客户定期召开会议并反馈客户的关键需求给公司。Hold regular meetings with customers and communicate critical customer requirements back to the company.

• 日常工作包括直接在客户公司提供现场支持，以及通过电话、邮件等方式与客户保持沟通，分析问题并及时为客户提供解决方案。Deliver on-site support at customer locations and maintain communication through phone calls, emails, and other channels; analyze issues and provide timely solutions.

• 一线支持职责：产品组、研发组以及客户之间的沟通桥梁。Serve as the primary communication bridge among Product Engineering, R&D teams, and customers.

• 产品支持：专注于针对先进节点的产品方案的调试，监控并推动客户项目的进展。Provide product support with a focus on debugging and optimizing solutions for advanced technology nodes; monitor and drive customer project progress.

• 客户反馈：协调和推动向客户提供的技术反馈。Coordinate and facilitate technical feedback delivery to customers.

• 项目职责：同客户、产品工程师一起制定技术指标和项目计划，起草项目规划、定期召开总结会议。Work with customers and product engineers to define technical targets and project plans; prepare project roadmaps and conduct regular project review meetings.

• 向产品及研发工程师报告技术需求和技术问题。Report customer technical requirements and issues to Product and R&D Engineering teams.

• 使用JIRA文档系统，管理客户案例。Manage customer cases using the JIRA documentation and tracking system.

• 开展现场培训以及协调客户的培训需求。Conduct on-site training sessions and coordinate customer training requirements.

• 每周追踪并定期报告客户项目进度。Track customer project progress on a weekly basis and provide regular status reports.

• 本职位要求一定程度的出差。Domestic and international travel may be required as part of this role.

要求 | Qualifications

• 物理、光学、计算机科学、化学工程、材料科学、数学等相关专业，硕士及以上学历。Master's degree or above in Physics, Optics, Computer Science, Chemical Engineering, Materials Science, Mathematics, or related disciplines.

• 熟悉OPC以及光刻技术。Solid knowledge of Optical Proximity Correction (OPC) and lithography technologies.

• 有良好的问题分析和解决能力。Strong analytical and problem-solving skills.

• 良好的沟通、计划组织、协作以及人员/项目领导能力。Excellent communication, planning, organizational, collaboration, and project leadership capabilities.

• 较强的人际交往能力以及在不同环境的工作适应能力。Strong interpersonal skills and the ability to adapt effectively to different working environments.

• 流利的英语表达能力。Fluent English communication skills, both written and verbal.

• 有掩膜版设计制造、物理版图设计、光刻及其它晶圆处理工艺方面背景优先。Experience in mask design and manufacturing, physical layout design, lithography, or other wafer processing technologies is highly preferred.