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Micron Technology

Makes memory and storage chips for AI and PCs

Senior Engineer Front End - Multiple Teams

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listed

About the Job

Requirements

  • A Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering, or a related field.
  • Five years of relevant experience in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical testing, and probe yield.
  • Three years of relevant experience with DRAM High Performance Memory (HPM), BEOL integration, advanced packaging, and layout.
  • Data analysis, troubleshooting, problem-solving, reporting, and presentation skills with attention to detail in the semiconductor industry.
  • Multitasking, verbal, and written communication skills.
  • Interpersonal skills and the ability to build customer and coworker relationships, with demonstrated teamwork and focus on team dynamics.
  • Organizational capabilities and the ability to work effectively with minimal supervision.
  • Intermediate to advanced proficiency in Microsoft Office, AI-enabled productivity tools such as Microsoft Copilot, and digital collaboration platforms.
  • Flexibility with job responsibilities and initiative to assume added responsibilities.
  • Willingness to travel as needed to support department goals; travel frequency is 20–50%.
  • Experience or strong aptitude in using AI, data analytics, and digital technologies to enhance engineering decision-making, operational efficiency, and cross-functional collaboration.

Responsibilities

  • Work with the global Micron network to drive silicon-node packaging product yield and quality improvement, new product introduction through technical expertise, business process management, and project execution.
  • Integrate solutions by connecting cross-functional expertise, standardizing business processes, and benchmarking internal and external intelligence to achieve high-value bits and productivity.
  • Leverage AI-enabled engineering approaches, advanced analytics, and digital tools to accelerate problem-solving, improve productivity, enhance decision quality, and drive continuous innovation across product yield, quality, and business processes.
  • Promote worldwide synergy and improved benchmark performance and efficiency through global project management and execution, network best-known-method leveraging and enhancement, and business process creation and re-engineering.
  • Define strategies to ensure Packaging Technology and its interaction with Front End manufacturing processes are developed and qualified well ahead of product qualification.
  • Lead the PI Loop taskforce and/or network team to address yield and quality challenges and optimize process flow in a timely manner to achieve best-in-class yield performance.
  • Maintain domain knowledge and technical expertise, and explore innovation opportunities using strategic thinking and a systematic approach.
  • Maintain open relationships with peers and managers in central and other functional areas, including Fab, TD, Product Engineering, and GQ; communicate about issues promptly and help resolve them where necessary.
  • Give effective presentations to small and large groups on project updates and new initiative proposals.
  • Follow up periodically with the manager to ensure goals are met and receive assistance removing obstacles.
  • Travel to Micron Fab locations as necessary for face-to-face work.
  • Drive AI and digital transformation initiatives using AI-powered tools, data analytics, automation solutions, and intelligent workflows to improve engineering efficiency, accelerate root cause analysis, enhance decision-making, and increase organizational productivity.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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