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ASM International

Semiconductor deposition equipment and ALD tech

Engineer – Field Process

Process EngineeringConfirmed live in the last 24 hours
Full-timeHsinchu, Hsinchu City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A Master of Science degree in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field.
  • Zero to six years of experience in semiconductor process engineering, thin-film deposition, or a related field.
  • Hands-on experience with at least one thin-film deposition technology through research, internships, academic projects, or industry experience.
  • Working knowledge of statistics and Design of Experiments, including the ability to analyze data and present findings effectively.
  • Familiarity with structured troubleshooting methodologies.
  • Ability to prepare technical reports and present results to internal and customer teams.
  • Willingness to travel 25–50% domestically and internationally to support customer activities.
  • Professional working proficiency in English and Chinese.

Responsibilities

  • Develop and optimize unit processes, including atomic layer deposition, plasma-enhanced atomic layer deposition, epitaxy, furnace, or plasma-enhanced chemical vapor deposition, on assigned applications.
  • Own day-to-day customer requests on a single product or film by scoping issues, running experiments, and presenting results.
  • Design and execute Design of Experiments to validate new technology performance and accelerate readiness for high-volume manufacturing.
  • Validate tool performance and provide structured findings to Product Management to improve the product.
  • Implement Best Known Methods and document qualification results to help the team improve its cycle time.
  • Bring innovative ideas to recipe tuning and stay current with the state of the art.
  • Identify tool safety risks and help train newer engineers on safe execution.

Desired Qualifications

  • Experience with thin-film deposition, plasma processing, atomic layer deposition, chemical vapor deposition, physical vapor deposition, or semiconductor manufacturing.
  • Hands-on experience with vacuum systems, gas delivery systems, or metrology tools such as scanning electron microscopy, X-ray reflectometry, or ellipsometry.
  • Knowledge of new product introduction, process qualification, or high-volume manufacturing environments.
  • Experience applying structured problem-solving methodologies such as 5-Why, Fishbone, or Failure Mode and Effects Analysis.
  • Passion for advanced semiconductor technologies and continuous learning.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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