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Analog Devices

Designs high-performance analog and DSP ICs

Assembly Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeZhubei City, TaiwanNo salary listed

About the Job

Requirements

  • A Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field is preferred.
  • At least 5 years of semiconductor manufacturing experience, preferably in assembly, packaging, test, or foundry operations.
  • Proven experience working directly with OSATs and managing outsourced manufacturing partners.
  • Strong understanding of semiconductor assembly, packaging, and test processes.
  • Experience with Statistical Process Control (SPC), Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), 8D, Corrective and Preventive Action (CAPA), and other structured problem-solving methodologies.
  • Familiarity with semiconductor quality systems and manufacturing best practices.
  • Strong analytical, project management, communication, and stakeholder management skills.
  • Fluency in English and Mandarin; Taiwanese proficiency is a plus.
  • Willingness to travel domestically and internationally as required.

Responsibilities

  • Monitor and drive OSAT performance across yield, quality, on-time delivery, cycle time, and cost metrics.
  • Analyze manufacturing data using SPC and other statistical tools to identify trends and drive continuous improvement.
  • Lead root cause analysis and corrective and preventive actions for yield, quality, and delivery issues.
  • Conduct regular technical and business reviews with subcontractors to ensure performance targets are achieved.
  • Identify and implement process improvements that enhance quality, efficiency, and cost competitiveness.
  • Support transfer of new products and technologies from research and development into high-volume manufacturing.
  • Lead product qualifications, process validation, and production ramp activities at OSAT sites.
  • Collaborate with Design, Product Engineering, Quality, and Operations teams to ensure manufacturing readiness.
  • Assess subcontractor capabilities and review manufacturing process flows, control plans, and test strategies.
  • Ensure compliance with company quality standards, manufacturing specifications, and operating procedures.
  • Drive process audits and continuous improvement initiatives at subcontractor facilities.
  • Partner with Quality and Reliability teams on failure analysis and corrective action implementation.
  • Act as the primary technical escalation point for manufacturing and quality issues.
  • Work with Planning and Supply Chain teams to align capacity with forecasted demand.
  • Monitor production loading and identify supply chain risks.
  • Support technical discussions related to supplier agreements and service-level expectations.
  • Provide technical guidance to manufacturing partners to resolve production challenges.
  • Communicate manufacturing performance, risks, and improvement plans to internal and external stakeholders.
  • Maintain accurate documentation of processes, qualifications, and operational performance.

Desired Qualifications

  • Experience with advanced packaging technologies such as System-in-Package (SiP), Ball Grid Array (BGA), Quad Flat No-leads (QFN), Wafer-Level Packaging (WLP), Fan-Out, or 3D Integrated Circuits (3D IC).
  • Knowledge of Manufacturing Execution Systems (MES), factory automation, and manufacturing analytics.
  • Lean Manufacturing and/or Six Sigma certification.
  • Experience in supply chain, contract manufacturing, or high-tech operations management.

About the Company

Analog Devices

Designs high-performance analog and DSP ICs

Analog Devices designs, manufactures, and markets high-performance analog, mixed-signal, and DSP integrated circuits used in many electronic devices. Its products include data converters, amplifiers, and power-management ICs that OEMs embed to sense, convert, and process signals, enabling reliable communication between the physical world and digital systems. ADI differentiates itself through a broad, specialized portfolio and close partnerships with OEMs across multiple industries—industrial, automotive, communications, and consumer—to solve complex engineering challenges. The company’s goal is to provide trusted signal-processing solutions that help customers design capable, reliable products by bridging the gap between the physical and digital domains.

Company size
10,001+
Company stage
IPO
Headquarters
Wilmington, MA
Founded
1965

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