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Reference platform targets robust 10BASE-T1S Ethernet design. New Products | April 4, 2026 By Jens Nickel A new system-level reference design platform aims to accelerate adoption of Single-Pair Ethernet (SPE) in industrial and building automation applications. Developed through a collaboration between Arrow, Microchip, Bourns and Amphenol, the REF_SPE_T1S platform provides a practical evaluation environment for engineers transitioning from legacy fieldbus technologies to Ethernet at the edge. The platform addresses a key challenge in SPE deployment: ensuring signal integrity and electromagnetic compatibility (EMC) in electrically noisy environments. It also highlights the growing importance of magnetics design in achieving reliable Ethernet communication beyond the PHY layer. Magnetics design drives SPE performance The REF_SPE_T1S platform is built around Microchip's LAN8670 10BASE-T1S PHY and an IEC 63171-6 compliant SPE connector from Amphenol. At its core is an integrated magnetics solution from Bourns, combining an isolation transformer and common-mode choke (CMC) in a single component. The design demonstrates how the magnetic interface between PHY and cable plays a critical role in overall SPE performance. According to the developers, integrated transformer-based isolation significantly improves common-mode noise rejection and galvanic isolation, particularly at low frequencies - an area where capacitor-only isolation approaches can fall short. This enhanced noise suppression helps maintain signal integrity and stable connections in harsh industrial environments, where conducted and radiated interference can degrade communication reliability. The approach also improves emissions margins, supporting compliance with EMC requirements. Supporting the shift from fieldbus to Ethernet As industrial systems migrate away from legacy communication standards such as CAN and RS-485, SPE is emerging as a key enabler for Ethernet connectivity down to sensor and actuator level. The REF_SPE_T1S platform is positioned as a tool to support this transition by providing measurable insights into network robustness. The USB-powered evaluation board allows engineers to compare transformer-based isolation with capacitor-based designs in real time. It supports both point-to-point and multidrop 10BASE-T1S configurations, enabling validation of network stability and channel performance before finalising product designs. Target applications include industrial automation, HVAC and building control systems, as well as embedded edge devices requiring reliable, low-speed Ethernet connectivity. By offering a reference schematic and live testing environment, the platform is intended to reduce design risk and accelerate time-to-market for SPE-enabled products. Overall, the REF_SPE_T1S highlights how careful optimisation of the physical layer - including magnetics and isolation strategy - remains critical as Ethernet continues to expand into increasingly demanding edge environments. At the Arrow webpage developers can apply for samples. Linked Articles

Arrow, Microchip, Bourns, and Amphenol produce reference design for SPE. Arrow, Microchip, Bourns, and Amphenol have come up with an evaluation platform - the 10BASE-T1S REF_SPE_T1S reference design board. The design assists engineers in adopting Single Pair Ethernet (SPE) by addressing the magnetic connection that links data to the physical cable and enables system-level evaluation of signal integrity, EMC behaviour, and noise immunity in real-world applications. SPE performance is defined not only by the PHY but by the quality of the magnetic interface that connects it to the cable. Built around Microchip's LAN8670 10BASE-T1S PHY and IEC 63171-6 compatible Amphenol's SPE connector, this design demonstrates how Bourns integrated isolation transformer and common-mode choke (CMC) magnetics (Model SM91081AL) play a critical role at the physical layer. By significantly improving common-mode noise rejection and galvanic isolation especially at low frequencies, the board helps maintain signal integrity and connection stability in electrically noisy industrial and building-automation environments. As industries transition away from legacy systems like CAN or RS-485, there is an increasing requirement for reliable Ethernet connectivity at the "edge," including sensors and actuators. By utilizing an integrated transformer design instead of traditional capacitor-only isolation approaches, this evaluation board offers improved signal clarity and connectivity, particularly through superior low-frequency noise attenuation and enhanced immunity to conducted and radiated interference. This approach provides a necessary margin for error against the electrical noise common in industrial settings and supports improved EMC and emissions performance, helping design engineers to meet regulatory compliance requirements more efficiently. Whether intended for factory automation, HVAC systems, or building controls, this SPE USB-powered platform provides a live demonstration of network robustness. Engineers can directly compare transformer-based isolation against capacitor isolation, observe common-mode noise suppression behaviour, and evaluate EMC and emissions performance. Arrow provides this tool as a reference schematic solution for new designs which also allows designers to measure network stability in both point-to-point and multidrop 10BASE-T1S configurations, validating network stability and SPE channel performance before a final product design is finalized. Advanced technical support and customization services are available from Arrow's engineering solutions center (ESC). The 10BASE-T1S REF_SPE_T1S reference design is available now through Arrow. For more information, please visit https://www.arrow.com/

Microchip Technology has launched its SAM9X75D5M System-in-Package, an AEC-Q100 Grade 2-qualified hybrid microcontroller unit for automotive human-machine interfaces. The device targets applications including digital cockpit clusters, smart clusters for two- and three-wheelers, HVAC controls and EV chargers. The SiP features an Arm926EJ-S processor and 512 Mbit DDR2 SDRAM, supporting displays up to 10 inches at 1024 × 768 pixels with interfaces including MIPI DSI, LVDS and parallel RGB. The device combines microprocessor processing, high memory density and microcontroller functionality in one package, streamlining PCB design whilst reducing routing complexity. It also shields designers from discrete DDR memory supply volatility whilst balancing cost, performance and power efficiency.