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ASM International

Semiconductor deposition equipment and ALD tech

Field Service Engineer Intern

Equipment Field ServiceConfirmed live in the last 24 hours
InternshipHillsboro, OR, USANo salary listed

About the Job

Requirements

  • The candidate must be currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Mechatronics, Electromechanical Engineering, Computer Engineering, or a related technical field.
  • The candidate should have an interest in semiconductor equipment, advanced manufacturing, robotics, automation, or complex electromechanical systems.
  • The candidate should have hands-on experience through coursework, labs, research, student projects, engineering clubs, previous internships, or personal technical projects.
  • The candidate should have a basic ability to read and interpret electrical, electronic, or electromechanical schematics.
  • The candidate must be willing to work in a cleanroom environment and follow established safety procedures.
  • The candidate should have basic proficiency with Microsoft Office applications.

Responsibilities

  • Work alongside experienced Field Service Engineers to support the installation, maintenance, troubleshooting, and performance of semiconductor equipment.
  • Gain hands-on experience with complex mechanical, electrical, vacuum, robotics, sensor, and control systems.
  • Assist with troubleshooting equipment issues using structured problem-solving techniques and guidance from experienced engineers.
  • Participate in equipment inspections, testing, diagnostics, and other engineering support activities.
  • Learn to use schematics, procedures, technical documentation, equipment data, and diagnostic tools to identify technical issues.
  • Work in a semiconductor cleanroom environment while following established safety, quality, and customer requirements.
  • Support continuous improvement projects focused on equipment reliability, serviceability, safety, and efficiency.
  • Collaborate with customers, process engineers, product teams, and other technical organizations.
  • Develop technical documentation and summarize findings, observations, and project results.
  • Complete a defined internship project addressing a real equipment, service, reliability, or engineering challenge.
  • Participate in team meetings, technical discussions, and training.
  • Present the internship project, results, and key learnings to the team at the conclusion of the program.

Desired Qualifications

  • Exposure to semiconductor manufacturing or wafer fabrication.
  • Coursework or projects involving robotics, automation, vacuum technology, electronics, mechanical systems, controls, plasma, or gas-delivery systems.
  • Experience using basic electrical or mechanical diagnostic and test equipment.
  • Previous internship, co-op, research, senior design, or hands-on engineering project experience.
  • Experience developing technical reports, engineering documentation, or project presentations.
  • Participation in engineering clubs, robotics teams, Formula SAE, IEEE, maker organizations, or similar technical activities.
  • Interest in data analysis, statistical methods, and structured problem solving.
  • Previous experience working in a team-oriented or customer-facing environment.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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