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Lumai

Licensing 3D-optics AI processing technology

Senior Hardware Engineer - Signal and Power Integrity

Board & Electronics DesignConfirmed live in the last 24 hours
Full-timeOxford, UKNo salary listed

About the Job

Requirements

  • A degree in electronic engineering, physics, or a related discipline, plus proven signal and power integrity experience on high-speed printed circuit board and/or package designs.
  • Proficiency with at least one major electromagnetic and circuit simulation suite, such as Ansys HFSS/SIwave, Keysight ADS, or Cadence Sigrity/Clarity.
  • Strong understanding of transmission line theory, S-parameters, crosstalk, loss mechanisms, and channel compliance metrics such as eye diagrams and COM.
  • Experience with IBIS and IBIS-AMI models for SerDes and memory interface simulation.
  • Solid knowledge of power delivery network design, including impedance targeting, decoupling optimisation, and DC IR drop analysis.

Responsibilities

  • Run pre-layout channel studies to set routing topologies, stackups, materials, and design constraints for high-speed interfaces.
  • Carry out post-layout signal integrity analysis of critical channels, including insertion and return loss, crosstalk, and eye and COM analysis using IBIS-AMI models.
  • Design and optimise vias, breakouts, connector launches, and transitions into optical engines and co-packaged components.
  • Set power delivery network impedance targets, design decoupling strategies, and run DC drop and AC power delivery network analysis for high-current ASIC and FPGA rails.
  • Support package, interposer, and board co-simulation with the ASIC team to maintain channel and power integrity end to end.
  • Correlate simulation with lab measurements using time-domain reflectometers, vector network analysers, and oscilloscopes, and feed results back into models and design rules.
  • Evaluate and characterise printed circuit board materials, connectors, and cable assemblies with suppliers and fabricators.
  • Build signal and power integrity methodology, model libraries, and reusable design guidelines.
  • Own signal and power integrity across boards and packages, including modelling, stackups, materials, and design rules.
  • Sign off critical channels on at least one board, build reusable model libraries and design guidelines, and determine when a layout is ready for release.

Desired Qualifications

  • Hands-on measurement with vector network analysers, time-domain reflectometers, and high-speed oscilloscopes, and the ability to correlate measurements with simulation.
  • Experience with 56G/112G PAM4 channels or PCIe Gen5/6 compliance.
  • Package and interposer co-simulation, including chip-package-board analysis.
  • Knowledge of low-loss printed circuit board materials and fabrication tolerances and their effect on high-speed performance.
  • Scripting in Python or MATLAB to automate simulation and post-processing.

About the Company

Lumai

Licensing 3D-optics AI processing technology

Lumai develops high-performance computing solutions powered by 3D optics to accelerate AI processing. Its offerings combine proprietary hardware tech with software tools, delivered via technology licensing and software sales, with potential consulting services. By leveraging 3D optical processing, Lumai aims to deliver faster computation and lower energy consumption for AI workloads, especially for customers needing scalable deep-tech compute. The company differentiates itself through its turn-key approach that pairs hardware-grade optical acceleration with developer tools, grounded in Oxford-era research in optics and quantum physics, and supported by a licensing-driven business model rather than pure hardware manufacturing. Overall, Lumai’s goal is to unlock the full potential of next-generation AI by increasing computational speed and energy efficiency across diverse industries.

Company size
11-50
Company stage
Early VC
Total funding
$13.8M
Headquarters
Oxford, United Kingdom
Founded
2022

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