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ASM International

Semiconductor deposition equipment and ALD tech

Manager 1 – Field Service - NPI

Equipment Field ServiceConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listed

About the Job

Requirements

  • A bachelor's degree in Mechanical Engineering, Electrical Engineering, Electronics Engineering, Materials Science, Physics, Mechatronics, or a related discipline is required for consideration; a master's degree in one of these disciplines is preferred.
  • Previous people-management, technical-leadership, or team-lead experience in a customer-facing semiconductor equipment environment.
  • Demonstrated experience leading NPI, technology development, beta evaluations, first-of-kind installations, or transfer of new equipment into production support.
  • Proven ability to lead teams through complex troubleshooting, customer escalations, changing priorities, and unclear ownership paths.
  • Strong understanding of semiconductor equipment systems, including vacuum systems, gas delivery, RF power, plasma systems, automation and robotics, and ALD, PEALD, PECVD, furnace, or related deposition platforms.
  • Experience with installation and qualification planning, operational readiness, structured problem-solving, root-cause analysis, and corrective-action management.
  • Ability to translate technical detail into clear priorities, risk assessments, recovery plans, and executive-level communication.
  • Ability to work across cultures, functions, and time zones and to travel internationally based on business needs.

Responsibilities

  • Lead and develop a team of NPI Field Service Engineers supporting first-of-kind tool installations, RFKs, beta evaluations, technology demonstrations, and other NPI activities at customer sites.
  • Own field service execution for factory readiness reviews, installation planning, startup, qualification, and customer acceptance milestones.
  • Establish resource, coverage, travel, training, and succession plans aligned with the NPI roadmap and customer deployment schedule.
  • Drive safe and disciplined execution, including compliance with company, customer, and site requirements.
  • Provide leadership during complex hardware and integration issues encountered during startup and qualification.
  • Partner closely with NPI Field Process Engineering to achieve hardware and process readiness and to align priorities, dependencies, and recovery plans.
  • Coordinate cross-functionally with Product teams, GPS, Manufacturing, R&D, Quality, Supply Chain, and local service organizations to close product and execution gaps.
  • Lead customer technical reviews and service-related escalation meetings; communicate status, risk, containment, recovery plans, and executive-level updates.
  • Define and track operational metrics for installation progress, qualification readiness, issue closure, repeat failures, documentation maturity, and transfer readiness.
  • Ensure structured problem-solving, root-cause analysis, corrective actions, and lessons learned are completed for critical field issues.
  • Drive development and standardization of installation procedures, troubleshooting guides, startup checklists, service documentation, and knowledge-management practices.
  • Identify product, serviceability, reliability, tooling, spare-parts, and documentation gaps; provide prioritized field feedback to engineering and product teams.
  • Build technical capability through coaching, mentoring, hands-on reviews, and training programs for NPI and local service teams.
  • Ensure effective transfer of knowledge and ownership from the NPI phase to regional and production support organizations before HVM deployment.
  • Support chamber upgrades, new hardware evaluations, and field-change implementation while controlling execution risk and customer impact.
  • Promote a collaborative, accountable, and customer-focused team culture in highly ambiguous startup environments.

Desired Qualifications

  • A master's degree in Mechanical Engineering, Electrical Engineering, Electronics Engineering, Materials Science, Physics, Mechatronics, or a related discipline.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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