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Micron Technology

Micron Technology

Memory and storage semiconductor manufacturer

ASIC Device Technology & Silicon Yield Engineering

Full-Time
No salary listed
Expert
Master's, PhD
Hyderabad, Telangana, India
In Person

About the job

Requirements
  • A Ph.D. or M.S. in Electrical Engineering, Materials Science, Physics, or Semiconductor Engineering, or equivalent experience.
  • At least 12 years of semiconductor industry experience.
  • A strong background in advanced complementary metal-oxide-semiconductor technology and silicon product development.
  • Proven success leading yield improvement, return-material-authorization, and failure-analysis efforts.
  • Experience working directly with foundries and outsourced semiconductor assembly and test partners.
  • Deep understanding of complementary metal-oxide-semiconductor device physics and advanced semiconductor process technologies.
  • Strong expertise in static random-access memory architecture, memory design fundamentals, memory margin analysis, and failure mechanisms.
  • Strong understanding of high-speed interface technologies, including Peripheral Component Interconnect Express, Open NAND Flash Interface, low-power double-data-rate memory, Serializer/Deserializer, and clocking architectures.
  • Experience with post-silicon debug and characterization of complex application-specific integrated circuit devices.
  • Expertise in process-design interaction analysis and variation-aware design methodologies.
  • Strong knowledge of signal integrity, power integrity, timing-closure methodologies, device variability and mismatch analysis, and reliability-induced failure mechanisms.
  • Experience correlating wafer acceptance test, electrical test data, yield data, reliability data, failure-analysis results, and customer-return information.
Responsibilities
  • Lead end-to-end investigations of silicon yield loss, field returns, customer escalations, and reliability failures.
  • Drive root-cause analysis for complex silicon issues spanning process, design, test, package, and system interactions.
  • Develop hypothesis-driven debug strategies and coordinate multifunctional execution.
  • Own resolution of critical yield and quality issues through containment, corrective actions, and prevention plans.
  • Analyze device-level failure mechanisms and process sensitivities impacting application-specific integrated circuit functionality and yield.
  • Evaluate design-process interactions affecting analog, mixed-signal, memory, high-speed input/output, and Peripheral Component Interconnect Express physical-layer performance.
  • Partner with foundry teams to understand process variations, excursions, reliability risks, and technology limitations.
  • Translate silicon learning into actionable design and process improvements.
  • Lead root-cause investigations involving design-process interactions affecting static random-access memory, Peripheral Component Interconnect Express physical layer, Open NAND Flash Interface, Serializer/Deserializer, analog/mixed-signal circuits, and high-speed digital subsystems.
  • Analyze silicon failures across transistor, circuit, block, die, package, and system levels.
  • Drive post-silicon debug activities involving design teams, design-for-test, product engineering, quality, reliability, foundry, and customer-support organizations.
  • Debug static random-access memory single-bit and multi-bit failures, read/write margin failures, timing and voltage sensitivity issues, Peripheral Component Interconnect Express physical-layer performance degradation, signal-integrity and jitter-related failures, yield excursions linked to process variation, and field-return and return-material-authorization failures.
  • Develop silicon characterization plans to isolate process-, design-, and test-related contributors.
  • Drive silicon learning feedback into next-generation application-specific integrated circuit architecture and design methodologies.
  • Drive advanced failure-analysis activities including focused ion beam, scanning electron microscopy/transmission electron microscopy, electrical failure analysis, optical beam induced resistance change, laser voltage probing, emission microscopy, and physical cross-section analysis.
  • Correlate failure signatures with design, process, and manufacturing data.
  • Interpret failure-analysis results and convert findings into clear engineering actions.
  • Lead technical reviews with Product Engineering, design-for-test, Design, Reliability, Quality, Operations, Foundry, and external partners.
  • Present complex technical findings to executive leadership.
  • Influence design and technology roadmaps to improve future product robustness and yield learning.
Desired Qualifications
  • Experience supporting solid-state-drive controllers, artificial-intelligence accelerators, networking, or high-performance-computing application-specific integrated circuits.
  • Expertise in Peripheral Component Interconnect Express physical layer, Serializer/Deserializer, memory subsystem, or analog mixed-signal debug.
  • A track record resolving field-quality issues visible to executive leadership and customers.
  • Experience applying artificial-intelligence and machine-learning tools for yield analytics, anomaly detection, and root-cause-analysis acceleration.
  • Experience mentoring engineering teams and driving multi-site technical investigations.

About the company

Micron Technology designs and manufactures memory and storage products, including DRAM, NAND, and NOR flash. These products power devices across computing, networking, automotive, industrial, and mobile markets. The company sells to OEMs, distributors, and end users worldwide and funds ongoing research and development to meet evolving needs. Micron aims to provide scalable memory solutions and maintain an inclusive, growth‑oriented workplace for its employees.

Company Size

10,001+

Company Stage

IPO

Headquarters

Boise, Idaho

Founded

1978

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Simplify's Take

What believers are saying

  • Fiscal Q3 2026 revenue hit $41.46 billion; Q4 guidance targets $50 billion.
  • Micron's August 2026 Boise fab buildout and research lab deepen U.S. capacity.
  • Micron reported about $100 billion in remaining performance obligations across fourteen agreements in September 2026.

What critics are saying

  • Taiwan unions threatened strike September 2026, targeting Micron's largest manufacturing base and supply chain.
  • Micron's HBM share fell to 18% in Q2 2026, behind SK Hynix's 24.9%.
  • A 2027 HBM price reset after current contracts expire would crush margins and valuation.

What makes Micron Technology unique

  • Micron remains the only U.S.-based memory manufacturer, unlike Samsung and SK Hynix.
  • HBM4 shipments topped $1 billion by June 2026, ahead of HBM4E in 2027.
  • Micron Research Labs in Boise launched August 2026 with a $10 billion decade plan.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

Disability Insurance

Parental Leave

Unlimited Paid Time Off

Paid Holidays

Flexible Work Hours

Growth & Insights and Company News

Headcount

6 month growth

4%

1 year growth

4%

2 year growth

4%
Yahoo Finance
Sep 15th, 2026
Micron appoints Deirdre Hanford as VP to lead memory and AI research labs

Micron Technology has appointed Deirdre Hanford as corporate vice president and president of Micron Research Labs, focusing on long-horizon memory and AI research. The stock has experienced recent volatility, falling 7.3% over the past week and 11.1% over 90 days amid AI-related headlines and sector pullbacks. However, shares remain up 194.1% year-to-date. Valuation estimates vary widely. One narrative suggests the stock is 54% undervalued with a fair value of $2,018.05 per share, based on projected margins exceeding 70% during tight market cycles. However, an alternative DCF model values shares at $574.63, below the current trading price of $927.60. Risks include capital-intensive fabrication requirements and exposure to trade tensions with China.

Yahoo Finance
Sep 15th, 2026
Micron appoints Deirdre Hanford to lead $10B research labs

Micron Technology has appointed Deirdre Hanford as corporate vice president and president of Micron Research Labs, the company's long-horizon research institution announced in August 2026. Hanford will establish the lab's research infrastructure, operating model and partnerships whilst defining a research agenda spanning Micron, academia, government, startups and the broader industry ecosystem. Micron Research Labs is headquartered in Boise, Idaho, and backed by Micron's planned $10 billion investment over the next decade. The facility is the first dedicated memory research hub of its kind in the US. Hanford brings extensive semiconductor industry experience, having spent 37 years at Synopsys in various leadership roles. She most recently advised organisations across semiconductors, electronic design automation, national defence and AI.

Yahoo Finance
Sep 15th, 2026
Micron demonstrates world's first 512GB DDR5 memory module for next-gen servers

Micron Technology has demonstrated the world's first 512GB DDR5 module for servers, marking a significant advancement in memory innovation. The module delivers speeds up to 9,200 MT/s whilst reducing operating power by more than 60 percent. The high capacity is achieved through Micron's advanced vertical interconnect packaging, which stacks DRAM dies using through-silicon vias. This enables up to 12TB of DDR5 DRAM in a single 24-slot dual-socket server. AMD and Intel are both validating the module for next-generation server platforms. The technology supports demanding AI, analytics, in-memory database, and simulation workloads with greater efficiency. The 512GB RDIMM allows multi-terabyte servers whilst maintaining existing server footprints, supporting larger workloads and improved virtualisation density.

Yahoo Finance
Sep 12th, 2026
Broadcom vs Micron: AI chip rivalry sees custom accelerators trump memory in 2026

Broadcom and Micron Technology are both capitalising on AI-driven demand, but offer different investment profiles. Broadcom provides diverse semiconductor and software solutions, whilst Micron specialises in memory and storage technologies. Broadcom reported fiscal 2025 revenue of $63.9 billion, up 23.9% year-over-year, with net income of $23.1 billion. The company has secured major agreements including a $200 billion memorandum of understanding with Samsung and a $30 billion chip commitment from Apple. Micron achieved fiscal 2025 revenue of $37.4 billion, a 48.9% increase, with net income of $8.5 billion. The memory specialist focuses heavily on data centres, which account for approximately 50% of total revenue. Both companies face customer concentration risks. Broadcom's top five customers represent around 40% of net revenue, whilst Micron derives over half its revenue from its top ten clients. Analysts favour Broadcom for its diversified portfolio and custom AI accelerator business, despite Micron's lower valuation metrics.

Yahoo Finance
Sep 12th, 2026
Micron shares drop 4.2% despite HBM shortage giving pricing power

Micron Technology fell 4.2% to $984.62 on Thursday despite a global high-bandwidth memory shortage giving suppliers increased pricing power. Chinese AI chip companies have raised prices due to scarce HBM supplies, with Huawei's upcoming Ascend accelerator reportedly becoming 20% to 50% more expensive. The American memory chip producer reported fiscal third-quarter revenue of $41.46 billion, up from $9.30 billion a year earlier. Adjusted free cash flow reached $18.3 billion, representing 44.1% of sales. Management expects approximately $50 billion in fourth-quarter revenue with an adjusted gross margin near 86%, implying a 20.6% sequential revenue increase. However, Micron's share price stands 56.92% above its GF Value estimate of $627.48, suggesting limited room for any cooling in AI demand or memory pricing.