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Micron Technology

Makes memory and storage chips for AI and PCs

Advanced DRAM and EM Device/Cell Technology Engineer

Hardware EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A Master's degree with five or more years of relevant industry experience, or a PhD with relevant hands-on research experience, in Electrical Engineering, Physics, or a related field.
  • Expertise in semiconductor device physics, including CMOS, diodes, and related devices.
  • Knowledge of memory technologies such as DRAM, NAND, NOR, or SRAM.
  • Experience with DRAM array characterization and failure analysis.
  • Experience leveraging artificial intelligence-enabled tools to support engineering data analysis, automate repetitive analytical workflows, and improve technical problem-solving.

Responsibilities

  • Define and drive electrical specifications for DRAM, advanced DRAM, and emerging memory technologies, translating product requirements into device-level targets for performance, reliability, and scaling.
  • Design, implement, and interpret experiments to optimize cell and access device performance, including conducting materials experiments, developing new integration schemes, and defining new characterization methodologies.
  • Develop physical and electrical models, including technology computer-aided design and compact modeling, to identify performance, yield, and reliability limiters using advanced materials characterization, device physics expertise, and statistical data analysis.
  • Develop or improve reliability stress-test methodologies to evaluate device reliability, including time-dependent dielectric breakdown, leakage, variability, and endurance, and establish robust design margins.
  • Analyze array-level behavior using probe, parametric, and backend data to identify root causes of variability, optimize distributions, and improve yield, quality, and cost efficiency.
  • Collaborate cross-functionally with process integration, design, and product engineering teams to translate device insights into technology and product improvements, enabling high-performing memory solutions.

Desired Qualifications

  • Experience working across process integration and circuit design or system architecture domains.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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