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Micron Technology

Makes memory and storage chips for AI and PCs

Principal RDA Process Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical field and 8+ years of semiconductor manufacturing, defect analysis, metrology, or process engineering experience.
  • Demonstrated experience leading complex defect reduction, yield improvement, or process control initiatives in a 300mm high-volume manufacturing environment.
  • Strong expertise in statistical analysis, data analytics, scripting, programming, or automation tools used for process optimization and decision making.
  • Proven ability to influence technical direction and drive alignment across cross-functional and global manufacturing organizations.
  • Experience presenting technical recommendations to senior leadership.

Responsibilities

  • Lead defect reduction initiatives through analysis of inline defect signals, process flows, and equipment performance across manufacturing sites.
  • Develop and implement advanced inspection strategies, methodologies, and controls to improve defect visibility and prevent process excursions.
  • Drive root cause investigations for complex defect and yield challenges while influencing corrective actions across cross-functional teams.
  • Partner with global manufacturing, process integration, yield, and development organizations to align best known methods and Realtime Defect Analysis strategy.
  • Mentor engineers and provide technical leadership in data-driven problem solving, defect characterization, and continuous improvement initiatives.

Desired Qualifications

  • A master's degree with 6+ years of experience or PhD with 4+ years of experience in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related field.
  • Experience with advanced defect inspection, metrology platforms, defect source characterization, and excursion management methodologies.
  • Demonstrated success developing new monitoring strategies, best known methods, or technology transfer plans across multiple manufacturing sites.
  • Experience leading cross-functional teams or serving as a recognized technical expert in semiconductor process engineering.
  • Experience using AI-assisted analytics to enhance data interpretation, anomaly detection, and yield improvement initiatives.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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